Assignee profile:

airweave inc.

City:

Aichi

Country:

Japan

Published Applications:

10

Last publication date:

2026-03-12

Patent Grants:

6

Last grant date:

2026-04-28

Top Inventors for applications by airweave inc.

These are the the leading inventors for applications assigned to airweave inc.:

Recent patent applications by airweave inc.

airweave inc. based in Aichi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-03-12
US20260070276A1
Performing operations; transporting

DEVICE FOR MANUFACTURING FILAMENT THREE-DIMENSIONAL BONDED MEMBER

#2 | 2025-02-20
US20250057341A1
Human necessities

PILLOW CUSHION AND METHOD FOR MANUFACTURING PILLOW CUSHION

#3 | 2024-11-14
US20240374047A1
Human necessities

MATTRESS AND METHOD FOR RECEIVING ORDER FOR MATTRESS

#4 | 2024-06-27 ✅ Patent 12,611,047 granted on 2026-04-28
US20240206640A1
Human necessities

MATTRESS AND METHOD FOR PRODUCING MATTRESS

#5 | 2024-06-20
US20240200262A1
Textiles; paper

CUT SURFACE SMOOTHING DEVICE AND MANUFACTURING SYSTEM

#6 | 2024-01-11 ✅ Patent 12,557,928 granted on 2026-02-24
US20240008664A1
Human necessities

CUSHIONING BODY AND METHOD FOR MANUFACTURING SAME

#7 | 2020-10-08 ✅ Patent 11,304,536 granted on 2022-04-19
US20200315365A1
Human necessities

Bedding and bedding cover sheet

#8 | 2019-05-02 ✅ Patent 10,806,272 granted on 2020-10-20
US20190125092A1
Human necessities

Mattress core material and bed mattress

#9 | 2018-05-31 ✅ Patent 10,766,761 granted on 2020-09-08
US20180148312A1
Performing operations; transporting

Three-dimensional filaments-linked structure manufacturing apparatus, manufacturing method of three-dimensional filaments-linked structure, and mattress core material

#10 | 2018-05-31 ✅ Patent 10,889,071 granted on 2021-01-12
US20180147792A1
Performing operations; transporting

Device for manufacturing filament three-dimensional bonded member and method for manufacturing filament three-dimensional bonded member

Also check out AIRWEAVE INC.'s (Aichi, Japan) applicant profile with 7 patent applications submitted.

AssigneeID:

135557 ⎘