Assignee profile:

Nikko-Materials Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

50

Last publication date:

2018-06-14

Patent Grants:

46

Last grant date:

2019-03-26

Top Inventors for applications by Nikko-Materials Co., Ltd.

These are the the leading inventors for applications assigned to Nikko-Materials Co., Ltd.:

Recent patent applications by Nikko-Materials Co., Ltd.

Nikko-Materials Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-06-14 ✅ Patent 10,239,299 granted on 2019-03-26
US20180162111A1
Performing operations; transporting

Laminating apparatus

#2 | 2015-01-29 ✅ Patent 10,081,170 granted on 2018-09-25
US20150027640A1
Performing operations; transporting

Laminating apparatus

#3 | 2010-01-26 ✅ Patent 7,651,783 granted on 2010-01-26
US10486274
-

Surface treated copper film

#4 | 2007-06-14 ✅ Patent 7,788,882 granted on 2010-09-07
US20070131545A1
Electricity

Packaging device and packaging method for hollow cathode type sputtering target

#5 | 2007-05-17 ✅ Patent 7,951,275 granted on 2011-05-31
US20070108046A1
Chemistry; metallurgy

Sputtering target and method for finishing surface of such target

#6 | 2007-05-10 ✅ Patent 8,172,960 granted on 2012-05-08
US20070102288A1
Chemistry; metallurgy

Tantalum sputtering target and method of manufacturing same

#7 | 2007-05-03 ✅ Patent 7,510,635 granted on 2009-03-31
US20070098626A1
Chemistry; metallurgy

High purity zinc oxide powder and method for production thereof, and high purity zinc oxide target and thin film of high purity zinc oxide

#8 | 2007-05-03
US20070098590A1
Chemistry; metallurgy

NI-PT ALLOY AND TARGET COMPRISING THE ALLOY

#9 | 2007-05-03 ✅ Patent 7,300,501 granted on 2007-11-27
US20070095249A1
Chemistry; metallurgy

Electroless gold plating liquid

#10 | 2007-04-05 ✅ Patent 7,605,481 granted on 2009-10-20
US20070074790A1
Chemistry; metallurgy

Nickel alloy sputtering target and nickel alloy thin film

#11 | 2007-03-08 ✅ Patent 7,695,527 granted on 2010-04-13
US20070053828A1
Chemistry; metallurgy

High purity copper sulfate and method for production thereof

#12 | 2007-03-08 ✅ Patent 9,472,383 granted on 2016-10-18
US20070051624A1
Electricity

Copper or copper alloy target/copper alloy backing plate assembly

#13 | 2007-02-20 ✅ Patent 7,179,741 granted on 2007-02-20
US10472678
-

Electroless plating method and semiconductor wafer on which metal plating layer is formed

#14 | 2007-02-01 ✅ Patent 7,892,367 granted on 2011-02-22
US20070023281A1
Chemistry; metallurgy

Tantalum sputtering target

#15 | 2006-12-28 ✅ Patent 8,871,144 granted on 2014-10-28
US20060292028A1
Chemistry; metallurgy

High-purity Ni-V alloy target therefrom high-purity Ni-V alloy thin film and process for producing high-purity Ni-V alloy

#16 | 2006-11-30 ✅ Patent 7,390,354 granted on 2008-06-24
US20060269761A1
Chemistry; metallurgy

Electroless gold plating solution

#17 | 2006-11-30
US20060266158A1
Chemistry; metallurgy

High purity hafnium, target and thin film comprising said high purity hafnium, and method for producing high purity hafnium

#18 | 2006-10-19 ✅ Patent 7,419,536 granted on 2008-09-02
US20060230979A1
Chemistry; metallurgy

Electroless gold plating liquid

#19 | 2006-09-28 ✅ Patent 7,432,335 granted on 2008-10-07
US20060217494A1
Chemistry; metallurgy

Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same

#20 | 2006-08-24 ✅ Patent 7,459,036 granted on 2008-12-02
US20060189164A1
Electricity

Hafnium alloy target and process for producing the same

#21 | 2006-08-22 ✅ Patent 7,094,845 granted on 2006-08-22
US10450421
-

Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same

#22 | 2006-08-10 ✅ Patent 8,231,728 granted on 2012-07-31
US20060178000A1
Chemistry; metallurgy

Epitaxial growth process

#23 | 2006-07-27 ✅ Patent 7,777,078 granted on 2010-08-17
US20060166032A1
Chemistry; metallurgy

Copper electrolytic solution and electrolytic copper foil produced therewith

#24 | 2006-07-06 ✅ Patent 7,635,440 granted on 2009-12-22
US20060147740A1
Chemistry; metallurgy

Sputtering target, thin film for optical information recording medium and process for producing the same

#25 | 2006-06-29 ✅ Patent 7,618,505 granted on 2009-11-17
US20060137782A1
Chemistry; metallurgy

Target of high-purity nickel or nickel alloy and its producing method

#26 | 2006-05-11 ✅ Patent 7,344,660 granted on 2008-03-18
US20060099126A1
Chemistry; metallurgy

Sputtering target and process for producing the same

#27 | 2006-04-27
US20060086610A1
Chemistry; metallurgy

Ge-cr alloy sputtering target and process for producing the same

#28 | 2006-04-06 ✅ Patent 7,252,794 granted on 2007-08-07
US20060071197A1
Chemistry; metallurgy

Electroconductive oxide sintered compact, sputtering target comprising the sintered compact and methods for producing them

#29 | 2006-03-16 ✅ Patent 8,173,093 granted on 2012-05-08
US20060057014A1
Chemistry; metallurgy

Iron silicide sputtering target and method for production thereof

#30 | 2006-02-28 ✅ Patent 7,005,055 granted on 2006-02-28
US10479896
-

Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same

#31 | 2006-02-23
US20060037680A1
Chemistry; metallurgy

Nickel alloy sputtering target

#32 | 2006-02-21 ✅ Patent 7,002,230 granted on 2006-02-21
US10771359
-

CdTe-base compound semiconductor single crystal for electro-optic element

#33 | 2006-01-05 ✅ Patent 7,740,796 granted on 2010-06-22
US20060002838A1
Chemistry; metallurgy

Iron silicide powder and method for production thereof

#34 | 2005-12-08 ✅ Patent 7,347,969 granted on 2008-03-25
US20050271540A1
Chemistry; metallurgy

Iron-based sintered compact and method for production thereof

#35 | 2005-12-08 ✅ Patent 7,699,948 granted on 2010-04-20
US20050268999A1
Chemistry; metallurgy

Ta sputtering target and method for preparation thereof

#36 | 2005-11-17 ✅ Patent 7,378,160 granted on 2008-05-27
US20050252778A1
Chemistry; metallurgy

Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same

#37 | 2005-11-01 ✅ Patent 6,960,391 granted on 2005-11-01
US10432517
-

Carrier-attached copper foil and printed board using the copper foil

#38 | 2005-10-20 ✅ Patent 7,887,603 granted on 2011-02-15
US20050232849A1
Chemistry; metallurgy

High purity copper sulfate and method for production thereof

#39 | 2005-09-01 ✅ Patent 7,045,871 granted on 2006-05-16
US20050189553A1
Electricity

II-VI compound semiconductor crystal and photoelectric conversion device

#40 | 2005-08-23 ✅ Patent 6,933,519 granted on 2005-08-23
US10381880
-

II-VI compound semiconductor crystal

#41 | 2005-08-16 ✅ Patent 6,929,772 granted on 2005-08-16
US10168198
-

Manufacturing method of ito powder with tin dissolved in indium oxide, and manufacturing method of ito target

#42 | 2005-08-11 ✅ Patent 7,144,491 granted on 2006-12-05
US20050173256A1
Chemistry; metallurgy

Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith

#43 | 2005-07-28 ✅ Patent 7,109,273 granted on 2006-09-19
US20050165195A1
Chemistry; metallurgy

Solid silane coupling agent composition, process for producing the same, and resin composition containing the same

#44 | 2005-07-26 ✅ Patent 6,921,577 granted on 2005-07-26
US10169893
-

Water-based metal surface treatment agent

#45 | 2005-07-14 ✅ Patent 7,288,242 granted on 2007-10-30
US20050152831A1
Electricity

Lithium-containing complex oxide and method of producing same

#46 | 2005-07-12 ✅ Patent 6,916,865 granted on 2005-07-12
US10451977
-

Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins

#47 | 2005-06-02 ✅ Patent 7,229,494 granted on 2007-06-12
US20050118739A1
Chemistry; metallurgy

Production method for compound semiconductor single crystal

#48 | 2005-05-31 ✅ Patent 6,900,522 granted on 2005-05-31
US10472518
-

Chamfered semiconductor wafer and method of manufacturing the same

#49 | 2005-04-05 ✅ Patent 6,875,272 granted on 2005-04-05
US10481253
-

Method for preparing GaN based compound semiconductor crystal

#50 | 2005-01-06 ✅ Patent 6,989,059 granted on 2006-01-24
US20050000403A1
Chemistry; metallurgy

Process for producing single crystal of compound semiconductor and crystal growing apparatus

Also check out Nikko-Materials Co., Ltd.'s (Tokyo, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

136035 ⎘