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Assignee profile:

MAVEN OPTRONICS CO., LTD.

City:

Hsinchu County

Country:

Taiwan

Published Applications:

17

Last publication date:

2022-11-17

Patent Grants:

17

Last grant date:

2024-07-23

Top Inventors for applications by MAVEN OPTRONICS CO., LTD.

These are the the leading inventors for applications assigned to MAVEN OPTRONICS CO., LTD.:

Recent patent applications by MAVEN OPTRONICS CO., LTD.

MAVEN OPTRONICS CO., LTD. based in Hsinchu County, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-11-17 ✅ Patent 12,044,922 granted on 2024-07-23
US20220365394A1
Physics

Curved full-array LED light panel, curved backlight module and curved LCD

 #2 | 2021-02-04 ✅ Patent 11,227,891 granted on 2022-01-18
US20210036051A1
Electricity

Chip-scale linear light-emitting device

 #3 | 2020-10-22 ✅ Patent 11,081,631 granted on 2021-08-03
US20200335678A1
Electricity

Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same

 #4 | 2019-09-26 ✅ Patent 10,797,102 granted on 2020-10-06
US20190296077A1
Electricity

Chip-scale linear light-emitting device

 #5 | 2019-08-15 ✅ Patent 11,335,842 granted on 2022-05-17
US20190252587A1
Electricity

Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same

 #6 | 2019-04-18 ✅ Patent 10,748,792 granted on 2020-08-18
US20190115233A1
Electricity

Method and system for mass arrangement of micro-component devices

 #7 | 2019-03-14 ✅ Patent 10,879,434 granted on 2020-12-29
US20190081219A1
Electricity

Quantum dot-based color-converted light emitting device and method for manufacturing the same

 #8 | 2019-01-24 ✅ Patent 10,749,086 granted on 2020-08-18
US20190025650A1
Physics

Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same

 #9 | 2018-07-26 ✅ Patent 10,522,728 granted on 2019-12-31
US20180212118A1
Electricity

Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same

 #10 | 2018-07-19 ✅ Patent 10,730,276 granted on 2020-08-04
US20180201007A1
Performing operations; transporting

System and method for vacuum film lamination

 #11 | 2018-02-08 ✅ Patent 10,230,027 granted on 2019-03-12
US20180040786A1
Electricity

Moisture-resistant chip scale packaging light-emitting device

 #12 | 2017-11-30 ✅ Patent 10,620,478 granted on 2020-04-14
US20170343859A1
Physics

Photoluminescent display device and method for manufacturing the same

 #13 | 2017-08-10 ✅ Patent 10,797,209 granted on 2020-10-06
US20170229621A1
Electricity

Light emitting device with beam shaping structure and manufacturing method of the same

 #14 | 2017-08-03 ✅ Patent 10,230,030 granted on 2019-03-12
US20170222107A1
Electricity

Light emitting device with asymmetrical radiation pattern and manufacturing method of the same

 #15 | 2017-07-13 ✅ Patent 10,615,320 granted on 2020-04-07
US20170200870A1
Electricity

Recessed chip scale packaging light emitting device and manufacturing method of the same

 #16 | 2017-07-06 ✅ Patent 10,693,046 granted on 2020-06-23
US20170194538A1
Electricity

Chip scale packaging light emitting device and manufacturing method of the same

 #17 | 2017-04-06 ✅ Patent 10,763,404 granted on 2020-09-01
US20170098743A1
Electricity

Light emitting device with beveled reflector and manufacturing method of the same

Also check out MAVEN OPTRONICS CO., LTD.'s (Hsinchu County, Taiwan) applicant profile with 10 patent applications submitted.

AssigneeID:

137322 ⎘