TOMOKU CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2018-08-16

Patent Grants:

Last grant date:

2020-10-13

Top Inventors for applications by TOMOKU CO., LTD.

These are the the leading inventors for applications assigned to TOMOKU CO., LTD.:

Shinji Hayami 1 Uji, Japan
Masaaki KANEMARU 1 Tokyo, Japan
Shinji HAYAMI 1 Uji-shi, Japan

Recent patent applications by TOMOKU CO., LTD.

TOMOKU CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-08-16 ✅ Patent 10,800,560 granted on 2020-10-13

US20180229868A1

Performing operations; transporting

Packaging kit, package, packaging method using packaging kit, packaging kit manufacturing apparatus, and packaging kit manufacturing method

Also check out TOMOKU CO., LTD.'s (Tokyo, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

138356 ⎘