CUSIC Inc.

City:

Sendai-shi, Miyagi

Country:

Japan

Published Applications:

Last publication date:

2020-01-02

Patent Grants:

Last grant date:

2021-11-16

Top Inventors for applications by CUSIC Inc.

These are the the leading inventors for applications assigned to CUSIC Inc.:

Hiroyuki Nagasawa 6 Sendai, Japan
Hiroyuki Nagasawa 6 Sendai-shi, Japan
Shoji Akiyama 6 Annaka-shi, Japan
Shoji Akiyama 6 Annaka, Japan

Yoshihiro Kubota 6 Annaka, Japan
Yoshihiro Kubota 6 Annaka-shi, Japan

Recent patent applications by CUSIC Inc.

CUSIC Inc. based in Sendai-shi, Miyagi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-01-02 ✅ Patent 11,177,123 granted on 2021-11-16

US20200006046A1

Electricity

Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element

#2 | 2019-12-19 ✅ Patent 11,346,018 granted on 2022-05-31

US20190382918A1

Chemistry; metallurgy

Silicon carbide substrate production method and silicon carbide substrate

#3 | 2019-05-23 ✅ Patent 10,431,460 granted on 2019-10-01

US20190157087A1

Electricity

Method for producing SiC composite substrate

#4 | 2018-11-22 ✅ Patent 10,612,157 granted on 2020-04-07

US20180334757A1

Chemistry; metallurgy

Method for manufacturing SiC composite substrate, and method for manufacturing semiconductor substrate

#5 | 2018-09-06 ✅ Patent 10,711,373 granted on 2020-07-14

US20180251911A1

Chemistry; metallurgy

SiC composite substrate and method for manufacturing same

#6 | 2018-09-06 ✅ Patent 10,829,868 granted on 2020-11-10

US20180251910A1

Chemistry; metallurgy

Manufacturing method of SiC composite substrate

Also check out CUSIC Inc.'s (Sendai-shi, Miyagi, Japan) applicant profile with 3 patent applications submitted.

AssigneeID:

139155 ⎘