New Albany, Indiana
United States
167
2025-03-13
151
2026-06-02
These are the the leading inventors for applications assigned to SAMTEC, INC.:
SAMTEC, INC. based in New Albany, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
FILLING MATERIALS AND METHODS OF FILLING VIAS
#2 | 2024-09-19 β Patent 12,603,450 granted on 2026-04-14CABLE CONNECTOR SYSTEMS
#3 | 2024-09-12 β Patent 12,476,117 granted on 2025-11-18ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME
#4 | 2024-06-13 β Patent 12,336,112 granted on 2025-06-17HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
#5 | 2024-05-23 β Patent 12,176,656 granted on 2024-12-24Overmolded lead frame providing contact support and impedance matching properties
#6 | 2024-02-22RACK-MOUNTABLE EQUIPMENT WITH A HIGH-HEAT-DISSIPATION MODULE, AND TRANSCEIVER RECEPTACLE WITH INCREASED COOLING
#7 | 2023-12-07 β Patent 12,487,419 granted on 2025-12-02VERTICAL INSERTION INTERCONNECTION SYSTEM WITH RING CONNECTOR FOR HIGH-SPEED DATA TRANSMISSION
#8 | 2023-11-30 β Patent 12,646,889 granted on 2026-06-02VERTICAL INTERCONNECT SYSTEM FOR HIGH-SPEED DATA TRANSMISSION
#9 | 2023-10-19 β Patent 12,531,383 granted on 2026-01-20TWINAXIAL CABLE SPLITTER
#10 | 2023-09-21 β Patent 12,500,377 granted on 2025-12-16HIGH-SPEED CONNECTOR WITH STRAIN RELIEF
#11 | 2023-08-10 β Patent 12,149,029 granted on 2024-11-19Electrical connector system
#12 | 2023-08-10 β Patent 12,140,809 granted on 2024-11-12Transceiver and interface for IC package
#13 | 2023-07-06 β Patent 12,283,394 granted on 2025-04-22Electrical cable with dielectric foam
#14 | 2023-06-08 β Patent 12,021,324 granted on 2024-06-25Cable connector systems
#15 | 2023-05-18 β Patent 12,207,430 granted on 2025-01-21Managing unwanted heat, mechanical stresses and EMI in electrical connectors and printed circuit boards
#16 | 2023-01-19 β Patent 11,600,956 granted on 2023-03-07Cable connector system
#17 | 2023-01-19 β Patent 12,230,902 granted on 2025-02-18Data communication system
#18 | 2023-01-05 β Patent 12,100,647 granted on 2024-09-24Electrically conductive vias and methods for producing same
#19 | 2022-12-22 β Patent 12,140,808 granted on 2024-11-12Electrical cable connector and board connector
#20 | 2022-11-03 β Patent 12,253,725 granted on 2025-03-18Sealed optical transceiver
#21 | 2022-09-22 β Patent 11,536,918 granted on 2022-12-27Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#22 | 2022-09-22 β Patent 11,536,917 granted on 2022-12-27Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#23 | 2022-09-08 β Patent 12,051,881 granted on 2024-07-30Connector with linear coaxial, right angle coaxial and optical connectors
#24 | 2022-08-25 β Patent 12,283,783 granted on 2025-04-22Rf connector
#25 | 2022-08-04 β Patent 11,650,383 granted on 2023-05-16Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#26 | 2022-07-28 β Patent 11,500,168 granted on 2022-11-15Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#27 | 2022-07-28 β Patent 11,500,167 granted on 2022-11-15Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#28 | 2022-07-14 β Patent 12,199,386 granted on 2025-01-14Lossy material for improved signal integrity
#29 | 2022-07-07 β Patent 12,087,989 granted on 2024-09-10RF waveguide cable assembly
#30 | 2022-06-30 β Patent 11,626,689 granted on 2023-04-11Electrical connector having latch
#31 | 2022-06-23 β Patent 11,883,057 granted on 2024-01-30Ultrasonic surgical instrument with transducer slip joint
#32 | 2022-06-09 β Patent 12,218,466 granted on 2025-02-04Impedance controlled electrical contact
#33 | 2022-05-05 β Patent 12,550,249 granted on 2026-02-10Flex Circuit And Electrical Communication Assemblies Related To Same
#34 | 2022-01-27 β Patent 11,735,844 granted on 2023-08-22Anti-backout latch for interconnect system
#35 | 2022-01-20 β Patent 11,846,816 granted on 2023-12-19Optical transceiver with versatile positioning
#36 | 2022-01-13 β Patent 11,621,523 granted on 2023-04-04Transceiver assembly array with fixed heatsink and floating transceivers
#37 | 2021-12-23 β Patent 11,923,640 granted on 2024-03-05Overmolded lead frame providing contact support and impedance matching properties
#38 | 2021-12-09 β Patent 11,605,480 granted on 2023-03-14Electrical cable with dielectric foam
#39 | 2021-11-18 β Patent 11,824,294 granted on 2023-11-21Printed circuit board having commoned ground plane
#40 | 2021-11-04 β Patent 11,576,260 granted on 2023-02-07Method and apparatus for terminating an electrical cable to an integrated circuit
#41 | 2021-10-14 β Patent 12,218,463 granted on 2025-02-04Lossy material for improved signal integrity
#42 | 2021-09-30 β Patent 11,374,360 granted on 2022-06-28Electrical contacts having anchoring regions with improved impedance characteristics
#43 | 2021-09-30 β Patent 11,588,262 granted on 2023-02-21Cable connector systems
#44 | 2021-08-26 β Patent 11,489,292 granted on 2022-11-01Cable connector system
#45 | 2021-08-19 β Patent 11,769,969 granted on 2023-09-26Hybrid electrical connector for high-frequency signals
#46 | 2021-07-15 β Patent 12,555,703 granted on 2026-02-17ELECTRICAL CABLE WITH ELECTRICALLY CONDUCTIVE COATING
#47 | 2021-07-15 β Patent 11,409,063 granted on 2022-08-09Optical interposer
#48 | 2021-06-24 β Patent 12,278,441 granted on 2025-04-15Ultra-dense, low-profile edge card connector
#49 | 2021-05-20 β Patent 11,289,850 granted on 2022-03-29Electrical connector having latch
#50 | 2021-05-20 β Patent 11,476,603 granted on 2022-10-18Compression-mounted electrical connector
#51 | 2021-04-29 β Patent 11,569,616 granted on 2023-01-31Connector with top- and bottom-stitched contacts
#52 | 2021-03-18 β Patent 11,693,194 granted on 2023-07-04Optical block with textured surface
#53 | 2021-02-11 β Patent 12,009,225 granted on 2024-06-11Electrically conductive vias and methods for producing same
#54 | 2021-01-28 β Patent 12,243,840 granted on 2025-03-04Wirebondable interposer for flip chip packaged integrated circuit die
#55 | 2020-12-24 β Patent 11,171,432 granted on 2021-11-09Anti-backout latch for interconnect system
#56 | 2020-11-26 β Patent 11,071,201 granted on 2021-07-20Method and apparatus for terminating an electrical cable to an integrated circuit
#57 | 2020-11-26 β Patent 11,081,822 granted on 2021-08-03Printed circuit board having commoned ground plane
#58 | 2020-11-05 β Patent 11,495,917 granted on 2022-11-08Right-angle electrical connector and electrical contacts for a right-angle connector
#59 | 2020-10-29 β Patent 11,107,702 granted on 2021-08-31Method for creating through-connected vias and conductors on a substrate
#60 | 2020-09-17 β Patent 11,125,956 granted on 2021-09-21Optical transceiver with versatile positioning
#61 | 2020-09-03 β Patent 11,495,899 granted on 2022-11-08Data communication system
#62 | 2020-07-09 β Patent 11,196,195 granted on 2021-12-07Interconnect system having retention features
#63 | 2020-07-02 β Patent 11,637,400 granted on 2023-04-25Electrical cable connector
#64 | 2020-06-04 β Patent 10,784,608 granted on 2020-09-22Printed circuit board having commoned ground plane
#65 | 2020-05-28 β Patent 10,727,084 granted on 2020-07-28Method for creating through-connected vias and conductors on a substrate
#66 | 2020-05-14 β Patent 11,177,614 granted on 2021-11-16Transceiver assembly array with fixed heatsink and floating transceivers
#67 | 2020-04-23 β Patent 11,056,838 granted on 2021-07-06Transceiver receptacle with EMI cage and bezel clips that provide high shielding effectiveness
#68 | 2020-03-12 β Patent 11,372,178 granted on 2022-06-28Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#69 | 2020-01-30 β Patent 11,139,619 granted on 2021-10-05Overmolded lead frame providing contact support and impedance matching properties
#70 | 2019-10-24 β Patent 11,646,246 granted on 2023-05-09Method of fabricating a glass substrate with a plurality of vias
#71 | 2019-10-03 β Patent 10,892,585 granted on 2021-01-12Interconnect module for both panel and mid board mounting
#72 | 2019-10-03 β Patent 11,251,109 granted on 2022-02-15Filling materials and methods of filling through holes of a substrate
#73 | 2019-08-29 β Patent 10,985,479 granted on 2021-04-20Compression-mounted electrical connector
#74 | 2019-08-15 β Patent 10,751,079 granted on 2020-08-25Ultrasonic surgical instrument with transducer slip joint
#75 | 2019-08-01 β Patent 11,089,716 granted on 2021-08-10Cage with an attached heatsink
#76 | 2019-06-13 β Patent 11,146,002 granted on 2021-10-12Direct-attach connector
#77 | 2019-01-17 β Patent 10,534,145 granted on 2020-01-14Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#78 | 2018-12-25 β Patent 10,164,708 granted on 2018-12-25Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
#79 | 2018-10-25 β Patent 10,466,433 granted on 2019-11-05Optical module including silicon photonics chip and coupler chip
#80 | 2018-07-12 β Patent 10,306,806 granted on 2019-05-28Cage with an attached heatsink
#81 | 2018-06-14 β Patent 10,363,058 granted on 2019-07-30Ultrasonic surgical instrument with transducer slip joint
#82 | 2018-05-24 β Patent 10,593,562 granted on 2020-03-17Method for creating through-connected vias and conductors on a substrate
#83 | 2018-04-05 β Patent 10,164,394 granted on 2018-12-25Direct-attach connector
#84 | 2018-02-08 β Patent 10,116,386 granted on 2018-10-30Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
#85 | 2017-12-05 β Patent 9,833,256 granted on 2017-12-05Ultrasonic surgical instrument with transducer slip joint
#86 | 2017-09-21 β Patent 10,170,882 granted on 2019-01-01Direct-attach connector
#87 | 2017-09-14 β Patent 10,001,609 granted on 2018-06-19Connector assembly
#88 | 2017-08-03 β Patent 10,436,992 granted on 2019-10-08Transceiver and interface for IC package
#89 | 2017-07-06 β Patent 9,843,135 granted on 2017-12-12Configurable, high-bandwidth connector
#90 | 2017-06-08 β Patent 9,819,413 granted on 2017-11-14Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
#91 | 2017-03-16 β Patent 10,114,182 granted on 2018-10-30Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
#92 | 2017-01-05 β Patent 9,915,797 granted on 2018-03-13Transceiver and interface for IC package
#93 | 2016-11-10 β Patent 9,915,796 granted on 2018-03-13Transceiver and interface for IC package
#94 | 2016-11-10 β Patent 9,835,811 granted on 2017-12-05Transceiver and interface for IC package
#95 | 2016-10-06 β Patent 9,841,572 granted on 2017-12-12Transceiver and interface for IC package
#96 | 2016-09-29 β Patent 10,884,198 granted on 2021-01-05Optical block with textured surface
#97 | 2016-09-15 β Patent 9,651,752 granted on 2017-05-16Transceiver and interface for IC package
#98 | 2016-04-21 β Patent 9,638,874 granted on 2017-05-02Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables
#99 | 2015-12-31 β Patent 9,690,056 granted on 2017-06-27Connector assembly
#100 | 2015-09-10 β Patent 9,660,361 granted on 2017-05-23Connector with secure wafer retention
Also check out SAMTEC INC.'s (New Albany, United States) applicant profile with 168 patent applications submitted.
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