RICHVIEW ELECTRONICS CO., LTD.

City:

Wuhan

Country:

China

Published Applications:

Last publication date:

2022-05-12

Patent Grants:

Last grant date:

2024-02-27

Top Inventors for applications by RICHVIEW ELECTRONICS CO., LTD.

These are the the leading inventors for applications assigned to RICHVIEW ELECTRONICS CO., LTD.:

Zhigang YANG 7 Zhuhai, China
Zhijian Wang 6 Zhuhai City, China
Zhigang Yang 6 Zhuhai City, China
Xianglan Wu 6 Zhuhai, China

Zhijian WANG 6 Zhuhai, China
Siping Bai 6 Zhuhai, China
Jinqiang Zhang 6 Zhuhai, China
Siping Bai 5 Zhuhai City, China

Jinqiang Zhang 5 Zhuhai City, China
Xianglan Wu 5 Zhuhai City, China
Honglin SONG 1 Zhuhai, China
Xinlin Xie 1 Shenzhen, China

Xianglan Wu 1 Zhuhai City, Guangdong, China
Nianqun YANG 1 Zhuhai, China
Zhiqiang ZHANG 1 Zhuhai, China
Nianqun Yang 1 Shenzhen, China

Jinqiang Zhang 1 Zhuhai City, Guangdong, China
Siping Bai 1 Zhuhai City, Guangdong, China

Recent patent applications by RICHVIEW ELECTRONICS CO., LTD.

RICHVIEW ELECTRONICS CO., LTD. based in Wuhan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-05-12 ✅ Patent 11,917,768 granted on 2024-02-27

US20220151081A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#2 | 2021-01-28 ✅ Patent 12,012,660 granted on 2024-06-18

US20210025061A1

Chemistry; metallurgy

Method for manufacturing LCP-based flexible copper-clad plate, and article thereof

#3 | 2020-10-29 ✅ Patent 11,032,915 granted on 2021-06-08

US20200344895A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#4 | 2020-10-15 ✅ Patent 11,266,027 granted on 2022-03-01

US20200329567A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#5 | 2019-10-03 ✅ Patent 10,757,820 granted on 2020-08-25

US20190306991A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#6 | 2019-08-01 ✅ Patent 10,757,821 granted on 2020-08-25

US20190239363A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#7 | 2018-11-08 ✅ Patent 10,321,581 granted on 2019-06-11

US20180324958A1

Electricity

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#8 | 2013-09-05 ✅ Patent 9,587,318 granted on 2017-03-07

US20130228468A1

Chemistry; metallurgy

Method for continuously producing flexible copper clad laminates

Also check out RICHVIEW ELECTRONICS CO., LTD.'s (Wuhan, China) applicant profile with 7 patent applications submitted.

AssigneeID:

141625 ⎘