🔗 Permalink

Assignee profile:

SHIN-ETSU ENGINEERING CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-03-19

Patent Grants:

Last grant date:

2023-04-25

Top Inventors for applications by SHIN-ETSU ENGINEERING CO., LTD.

These are the the leading inventors for applications assigned to SHIN-ETSU ENGINEERING CO., LTD.:

Yoshikazu OHTANI 6 Gunma, Japan
Kyouhei TOMIOKA 5 Gunma, Japan
Yoshikazu OHTANI 3 Annaka-shi, Japan
Taketo Usami 2 Shinagawa-ku, Japan

Kazuma KAWAGOE 2 Tokyo, Japan
Hiroshi Yamaoka 2 Yokohama-shi, Japan
Hiroyuki Yamazaki 2 Joetsu-shi, Japan
Masami Kurata 2 Nerima-ku, Japan

Masaki Takeuchi 2 Joetsu-shi, Japan
Masao Ando 2 Joetsu-shi, Japan
Emi Matsui 1 Yokohama, Japan
Ryouichi INABA 1 Gunma, Japan

Michiya YOKOTA 1 Gunma, Japan
Masanao Sasaki 1 Nishigo-mura, Japan
Manabu Tokeshi 1 Sapporo-shi, Japan
Yoshikazu Ohtani 1 Annaka, Japan

Takahiro Matsuda 1 Annaka, Japan
Yasuharu ARIGA 1 Nishigo-mura, Japan
Katsuhiro Yamazaki 1 Yokohama, Japan
Muneyuki KOJIMA 1 Nagano-shi, Japan

Hiromasa HASHIMOTO 1 Nishigo-mura, Japan
Takahiro MATSUDA 1 Annaka-shi, Japan
Yoshikazu OHTANI 1 Tokyo, Japan
Shunya Kubota 1 Yokohama, Japan

Kyouhei Tomioka 1 Annaka, Japan
Masatoshi MAEKI 1 Sapporo shi, Japan
Katsuhiro YAMAZAKI 1 Yokohama-shi, Japan
Hiroshi Hashigami 1 Annaka-shi, Japan

Kyouhei TOMIOKA 1 Annaka-shi, Japan
Emi MATSUI 1 Yokohama-shi, Japan
Hiroharu MORI 1 Tokyo, Japan
Shunya KUBOTA 1 Yokohama-shi, Japan

Hiroshi TAKAHASHI 1 Tokyo, Japan

Recent patent applications by SHIN-ETSU ENGINEERING CO., LTD.

SHIN-ETSU ENGINEERING CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-03-19

US20260077324A1

Performing operations; transporting

CONTINUOUS FLOW MICROFLUIDIC SYSTEM AND METHOD FOR PRODUCING SELF-ASSEMBLED SUBSTANCE PARTICLES

#2 | 2025-01-16

US20250018510A1

Performing operations; transporting

LASER LIFT-OFF METHOD, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, LASER LIFT-OFF APPARATUS, AND PHOTOMASK

#3 | 2024-12-05

US20240399497A1

Performing operations; transporting

PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD OF SUBSTRATE

#4 | 2024-11-14

US20240375115A1

Performing operations; transporting

Microfluidic Device

#5 | 2024-07-11

US20240234140A1

Electricity

FILM FORMING APPARATUS AND METHOD OF FORMING CRYSTALLINE SEMICONDUCTOR FILM USING THE SAME

#6 | 2024-02-15

US20240051068A1

Performing operations; transporting

TRANSFER APPARATUS AND TRANSFER METHOD

#7 | 2023-10-12

US20230321752A1

Performing operations; transporting

WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD

#8 | 2022-12-29 ✅ Patent 11,633,810 granted on 2023-04-25

US20220410321A1

Performing operations; transporting

Workpiece-separating device and workpiece-separating method

#9 | 2022-03-03 ✅ Patent 11,251,058 granted on 2022-02-15

US20220068676A1

Electricity

Workpiece-separating device and workpiece-separating method

#10 | 2021-08-12 ✅ Patent 11,654,513 granted on 2023-05-23

US20210245297A1

Performing operations; transporting

Workpiece-separating device and workpiece-separating method

#11 | 2021-04-01 ✅ Patent 11,322,384 granted on 2022-05-03

US20210098279A1

Electricity

Substrate processing apparatus and substrate processing method

#12 | 2020-10-01 ✅ Patent 10,840,141 granted on 2020-11-17

US20200312716A1

Electricity

Workpiece-separating device and workpiece-separating method

#13 | 2019-04-11

US20190109021A1

Electricity

RESIN-SEALING DEVICE AND RESIN-SEALING METHOD

#14 | 2016-04-14 ✅ Patent 10,293,460 granted on 2019-05-21

US20160101503A1

Performing operations; transporting

Method of producing polishing head and polishing apparatus

Also check out SHIN-ETSU ENGINEERING CO., LTD.'s (Tokyo, Japan) applicant profile with 11 patent applications submitted.

AssigneeID:

147338 ⎘