Hukou Township
Taiwan
26
2025-01-30
14
2026-02-24
These are the the leading inventors for applications assigned to Powertech Technology Inc.:
Powertech Technology Inc. based in Hukou Township, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
IMAGE SENSOR PACKAGE
#2 | 2024-01-18IMAGE SENSOR PACKAGE WITH LOW LIGHT-SENSING NOISE
#3 | 2024-01-18CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
#4 | 2023-06-29 ✅ Patent 12,094,809 granted on 2024-09-17Chip-middle type fan-out panel-level package and packaging method thereof
#5 | 2022-10-20 ✅ Patent 11,693,043 granted on 2023-07-04Test head assembly for semiconductor device
#6 | 2022-09-22 ✅ Patent 11,670,611 granted on 2023-06-06Semiconductor package comprising plurality of bumps and fabricating method
#7 | 2022-05-26 ✅ Patent 11,670,622 granted on 2023-06-06Stacked semiconductor package and packaging method thereof
#8 | 2022-05-12 ✅ Patent 11,694,950 granted on 2023-07-04Semiconductor package
#9 | 2022-04-28 ✅ Patent 11,488,946 granted on 2022-11-01Package method of a modular stacked semiconductor package
#10 | 2022-04-21POWDER SPRAYING DEVICE FOR A SEMICONDUCTOR MOLDING PROCESS AND SPRAYING METHOD THEREOF
#11 | 2022-04-21HEAD OF A CHIP PICKER
#12 | 2022-03-31MANUAL LABELING DEVICE
#13 | 2022-02-03 ✅ Patent 11,362,055 granted on 2022-06-14Bump structure of the semiconductor package
#14 | 2022-01-06 ✅ Patent 11,608,205 granted on 2023-03-21Head of a tag device
#15 | 2021-11-04LASER CUTTING METHOD FOR A WAFER
#16 | 2021-09-16 ✅ Patent 11,410,945 granted on 2022-08-09Semiconductor package having partial outer metal layer and packaging method thereof
#17 | 2021-09-09MULTI-MOLDING METHOD FOR FAN-OUT STACKED SEMICONDUCTOR PACKAGE
#18 | 2021-09-02REDISTRIBUTION LAYER OF FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
#19 | 2021-07-15 ✅ Patent 11,658,046 granted on 2023-05-23Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof
#20 | 2021-02-18FAN-OUT SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#21 | 2020-10-01SEMICONDUCTOR PACKAGE WITH AN INTERNAL HEAT SINK AND METHOD FOR MANUFACTURING THE SAME
#22 | 2020-07-02FAN-OUT PACKAGE WITH WARPAGE REDUCTION AND MANUFACTURING METHOD THEREOF
#23 | 2020-06-25 ✅ Patent 10,892,250 granted on 2021-01-12Stacked package structure with encapsulation and redistribution layer and fabricating method thereof
#24 | 2020-06-11 ✅ Patent 10,802,068 granted on 2020-10-13Method of detecting abnormal test signal channel of automatic test equipment
#25 | 2019-07-11STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME
#26 | 2019-07-11 ✅ Patent 10,354,978 granted on 2019-07-16Stacked package including exterior conductive element and a manufacturing method of the same
Also check out Powertech Technology Inc.'s (Hukou Township, Taiwan) applicant profile with 2 patent applications submitted.
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