DisSolves, Inc.

City:

Pleasant Hills, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2025-04-24

Patent Grants:

Last grant date:

2025-01-21

Top Inventors for applications by DisSolves, Inc.

These are the the leading inventors for applications assigned to DisSolves, Inc.:

Jared Richard RASZEWSKI 3 Pleasant Hills, PA United States

Recent patent applications by DisSolves, Inc.

DisSolves, Inc. based in Pleasant Hills, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-04-24

US20250129236A1

Chemistry; metallurgy

PACKAGING FILMS AND METHODS OF MAKING THE SAME

#2 | 2024-01-04 ✅ Patent 12,202,963 granted on 2025-01-21

US20240002641A1

Chemistry; metallurgy

Packaging films and methods of making the same

#3 | 2019-08-15 ✅ Patent 11,795,305 granted on 2023-10-24

US20190248989A1

Chemistry; metallurgy

Packaging films

Also check out DisSolves, Inc.'s (Pleasant Hills, United States) applicant profile with 3 patent applications submitted.

AssigneeID:

152156 ⎘