Tokyo
Japan
46
2024-10-10
41
2024-10-08
These are the the leading inventors for applications assigned to NAPRA CO., LTD.:
NAPRA CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
TERMINAL
#2 | 2022-07-14 ✅ Patent 11,534,870 granted on 2022-12-27Metal particle
#3 | 2021-09-16 ✅ Patent 11,364,575 granted on 2022-06-21Metal particle
#4 | 2021-03-18 ✅ Patent 11,453,089 granted on 2022-09-27Bonding structure
#5 | 2018-11-01 ✅ Patent 10,478,924 granted on 2019-11-19Metal particle and electroconductive paste formed therefrom
#6 | 2018-10-11 ✅ Patent 10,507,551 granted on 2019-12-17Metal particle and articles formed therefrom
#7 | 2018-09-20 ✅ Patent 10,468,376 granted on 2019-11-05Semiconductor device and method for manufacturing the same
#8 | 2018-08-02 ✅ Patent 10,629,506 granted on 2020-04-21Preform for semiconductor encapsulation
#9 | 2018-02-22 ✅ Patent 9,924,592 granted on 2018-03-20Three-dimensional laminated circuit board, electronic device, information processing system, and information network system
#10 | 2018-01-11 ✅ Patent 9,950,496 granted on 2018-04-24Multi-layer preform sheet
#11 | 2017-10-26 ✅ Patent 9,950,925 granted on 2018-04-24Method for forming functional part in minute space
#12 | 2017-10-05 ✅ Patent 10,016,848 granted on 2018-07-10Metal particles having intermetallic compound nano-composite structure crystal
#13 | 2017-08-17 ✅ Patent 9,735,074 granted on 2017-08-15Semiconductor device
#14 | 2016-12-06 ✅ Patent 9,515,044 granted on 2016-12-06Electronic device, method of manufacturing the same, metal particle, and electroconductive paste
#15 | 2015-12-10 ✅ Patent 9,460,965 granted on 2016-10-04Semiconductor substrate, eletronic device and method for manufacturing the same
#16 | 2015-08-13METHOD FOR FORMING CONDUCTOR IN MINUTE SPACE
#17 | 2015-04-09 ✅ Patent 9,142,518 granted on 2015-09-22Junction and electrical connection
#18 | 2015-02-26 ✅ Patent 9,293,416 granted on 2016-03-22Functional material
#19 | 2015-02-12 ✅ Patent 9,076,786 granted on 2015-07-07Wiring substrate and manufacturing method therefor
#20 | 2015-02-05 ✅ Patent 9,349,720 granted on 2016-05-24Integrated circuit device
#21 | 2014-10-02 ✅ Patent 9,339,871 granted on 2016-05-17Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flow
#22 | 2014-07-24 ✅ Patent 9,730,325 granted on 2017-08-08Substrate with built-in passive element
#23 | 2014-05-29 ✅ Patent 9,691,519 granted on 2017-06-27Insulating paste, electronic device and method for forming insulator
#24 | 2014-01-23METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE
#25 | 2013-10-24ELECTRONIC DEVICE
#26 | 2013-09-26CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT
#27 | 2013-05-30METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
#28 | 2013-03-28 ✅ Patent 9,230,860 granted on 2016-01-05Semiconductor substrate, electronic device and method for manufacturing the same
#29 | 2012-07-10 ✅ Patent 8,217,403 granted on 2012-07-10Electronic device
#30 | 2012-07-05 ✅ Patent 9,704,793 granted on 2017-07-11Substrate for electronic device and electronic device
#31 | 2012-04-19 ✅ Patent 8,766,312 granted on 2014-07-01Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the same
#32 | 2011-11-24 ✅ Patent 9,685,394 granted on 2017-06-20Electronic device and manufacturing method therefor
#33 | 2011-10-27 ✅ Patent 8,377,565 granted on 2013-02-19Filling material and filling method using the same
#34 | 2011-06-16 ✅ Patent 8,609,999 granted on 2013-12-17Circuit board, electronic device and method for manufacturing the same
#35 | 2011-06-16 ✅ Patent 8,580,581 granted on 2013-11-12Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
#36 | 2011-05-26 ✅ Patent 8,217,280 granted on 2012-07-10Circuit board, electronic device and method for manufacturing the same
#37 | 2010-12-02 ✅ Patent 8,415,784 granted on 2013-04-09Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
#38 | 2010-11-30 ✅ Patent 7,842,958 granted on 2010-11-30Light-emitting diode, light-emitting device, lighting apparatus, display, and signal light
#39 | 2010-09-23 ✅ Patent 8,758,900 granted on 2014-06-24Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same
#40 | 2010-05-27 ✅ Patent 8,079,131 granted on 2011-12-20Method for filling metal into fine space
#41 | 2009-12-10 ✅ Patent 7,736,585 granted on 2010-06-15Metal powder with nano-composite structure and its production method using a self-assembling technique
#42 | 2009-04-02 ✅ Patent 7,910,837 granted on 2011-03-22Circuit board, electronic device and method for manufacturing the same
#43 | 2008-06-05 ✅ Patent 7,781,382 granted on 2010-08-24Lubricant composition and bearing structure
#44 | 2008-04-24 ✅ Patent 8,569,632 granted on 2013-10-29Wiring board having through hole or non-through hole, and method for producing the same
#45 | 2008-02-14 ✅ Patent 7,803,210 granted on 2010-09-28Method for producing spherical particles having nanometer size, crystalline structure, and good sphericity
#46 | 2006-07-06 ✅ Patent 7,547,346 granted on 2009-06-16Metal powder with nano-composite structure and its production method using a self assembling technique
Also check out NAPRA CO., LTD.'s (Tokyo, Japan) applicant profile with 14 patent applications submitted.
15600 ⎘