Cheongju-si
South Korea
13
2024-07-11
9
2025-07-29
These are the the leading inventors for applications assigned to STEMCO CO., LTD.:
STEMCO CO., LTD. based in Cheongju-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE INCLUDING MULTILAYER SUBSTRATE
#2 | 2024-01-04SUBSTRATE PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
#3 | 2023-12-21 ✅ Patent 12,376,238 granted on 2025-07-29CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING SAME CIRCUIT BOARD
#4 | 2023-06-15COIL SUBSTRATE AND ELECTRONIC APPARATUS INCLUDING THE SAME
#5 | 2022-09-08 ✅ Patent 12,256,500 granted on 2025-03-18Circuit board and manufacturing method therefor
#6 | 2022-04-21 ✅ Patent 12,476,036 granted on 2025-11-18COIL APPARATUS
#7 | 2021-11-04FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND PACKAGE HAVING FLEXIBLE CIRCUIT BOARD
#8 | 2021-10-28 ✅ Patent 12,028,990 granted on 2024-07-02Multilayer board and method for manufacturing same
#9 | 2021-03-18 ✅ Patent 12,100,540 granted on 2024-09-24Coil device and method for manufacturing the same
#10 | 2021-03-11 ✅ Patent 11,956,904 granted on 2024-04-09Multilayer circuit board and manufacturing method therefor
#11 | 2020-11-26 ✅ Patent 11,497,116 granted on 2022-11-08Flexible circuit board and electronic device comprising same
#12 | 2020-07-09 ✅ Patent 11,147,160 granted on 2021-10-12Circuit board and method for manufacturing same
#13 | 2020-06-18 ✅ Patent 11,197,377 granted on 2021-12-07Flexible circuit board and method for producing same
Also check out STEMCO CO., LTD.'s (Cheongju-si, South Korea) applicant profile with 10 patent applications submitted.
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