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Assignee profile:

CATLAM, LLC.

City:

Sunnyvale, California

Country:

United States

Published Applications:

16

Last publication date:

2023-08-03

Patent Grants:

15

Last grant date:

2025-12-30

Top Inventors for applications by CATLAM, LLC.

These are the the leading inventors for applications assigned to CATLAM, LLC.:

Recent patent applications by CATLAM, LLC.

CATLAM, LLC. based in Sunnyvale, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-08-03 ✅ Patent 12,513,827 granted on 2025-12-30
US20230247774A1
Electricity

Semi-Additive Process for Printed Circuit Boards

 #2 | 2023-03-30
US20230096301A1
Electricity

Circuit Board Traces in Channels using Electroless and Electroplated Depositions

 #3 | 2021-09-09 ✅ Patent 11,406,024 granted on 2022-08-02
US20210282274A1
Electricity

Multi-layer circuit board with traces thicker than a circuit board

 #4 | 2021-02-18 ✅ Patent 11,653,453 granted on 2023-05-16
US20210051804A1
Electricity

Electroless and electrolytic deposition process for forming traces on a catalytic laminate

 #5 | 2021-01-21 ✅ Patent 11,477,893 granted on 2022-10-18
US20210022252A1
Electricity

Catalytic laminate with conductive traces formed during lamination

 #6 | 2020-12-24 ✅ Patent 10,959,329 granted on 2021-03-23
US20200404785A1
Electricity

Circuit board using non-catalytic laminate with catalytic adhesive overlay

 #7 | 2020-12-10 ✅ Patent 11,638,354 granted on 2023-04-25
US20200389983A1
Electricity

Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil

 #8 | 2020-07-02 ✅ Patent 11,039,540 granted on 2021-06-15
US20200214144A1
Electricity

Multi-layer circuit board with traces thicker than a circuit board layer

 #9 | 2019-10-17 ✅ Patent 10,765,003 granted on 2020-09-01
US20190320530A1
Electricity

Method for making a multi-layer circuit board using conductive paste with interposer layer

 #10 | 2019-09-05 ✅ Patent 10,827,624 granted on 2020-11-03
US20190274221A1
Electricity

Catalytic laminate with conductive traces formed during lamination

 #11 | 2019-08-01 ✅ Patent 10,806,029 granted on 2020-10-13
US20190239349A1
Electricity

Catalytic circuit board with traces and vias

 #12 | 2019-01-10 ✅ Patent 10,765,012 granted on 2020-09-01
US20190014667A1
Electricity

Process for printed circuit boards using backing foil

 #13 | 2019-01-10 ✅ Patent 10,849,233 granted on 2020-11-24
US20190014666A1
Electricity

Process for forming traces on a catalytic laminate

 #14 | 2019-01-03 ✅ Patent 10,349,520 granted on 2019-07-09
US20190008044A1
Electricity

Multi-layer circuit board using interposer layer and conductive paste

 #15 | 2018-06-07 ✅ Patent 10,685,931 granted on 2020-06-16
US20180158793A1
Electricity

Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive

 #16 | 2016-05-26 ✅ Patent 10,573,610 granted on 2020-02-25
US20160148893A1
Electricity

Method for wafer level packaging

Also check out CATLAM LLC's (Sunnyvale, United States) applicant profile with 11 patent applications submitted.

AssigneeID:

160364 ⎘