Maple Grove, Minnesota
United States
51
2018-01-11
50
2019-10-22
These are the the leading inventors for applications assigned to HSIO TECHNOLOGIES, LLC:
HSIO TECHNOLOGIES, LLC based in Maple Grove, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrate
#2 | 2017-10-19 ✅ Patent 10,609,819 granted on 2020-03-31Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
#3 | 2016-09-22 ✅ Patent 9,755,335 granted on 2017-09-05Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
#4 | 2016-09-22 ✅ Patent 9,559,447 granted on 2017-01-31Mechanical contact retention within an electrical connector
#5 | 2016-07-21 ✅ Patent 10,506,722 granted on 2019-12-10Fusion bonded liquid crystal polymer electrical circuit structure
#6 | 2016-06-30 ✅ Patent 9,761,520 granted on 2017-09-12Method of making an electrical connector having electrodeposited terminals
#7 | 2016-01-14 ✅ Patent 10,159,154 granted on 2018-12-18Fusion bonded liquid crystal polymer circuit structure
#8 | 2015-10-01 ✅ Patent 9,536,815 granted on 2017-01-03Semiconductor socket with direct selective metalization
#9 | 2015-06-25 ✅ Patent 9,699,906 granted on 2017-07-04Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
#10 | 2015-06-11 ✅ Patent 9,660,368 granted on 2017-05-23High performance surface mount electrical interconnect
#11 | 2015-05-21 ✅ Patent 9,350,124 granted on 2016-05-24High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
#12 | 2015-04-02 ✅ Patent 9,689,897 granted on 2017-06-27Performance enhanced semiconductor socket
#13 | 2014-08-28 ✅ Patent 9,350,093 granted on 2016-05-24Selective metalization of electrical connector or socket housing
#14 | 2014-08-14 ✅ Patent 9,930,775 granted on 2018-03-27Copper pillar full metal via electrical circuit structure
#15 | 2014-08-07 ✅ Patent 9,318,862 granted on 2016-04-19Method of making an electronic interconnect
#16 | 2014-07-10 ✅ Patent 9,603,249 granted on 2017-03-21Direct metalization of electrical circuit structures
#17 | 2014-03-20 ✅ Patent 9,076,884 granted on 2015-07-07Compliant printed circuit semiconductor package
#18 | 2014-02-13 ✅ Patent 8,829,671 granted on 2014-09-09Compliant core peripheral lead semiconductor socket
#19 | 2013-12-12 ✅ Patent 8,704,377 granted on 2014-04-22Compliant conductive nano-particle electrical interconnect
#20 | 2013-09-19 ✅ Patent 9,093,767 granted on 2015-07-28High performance surface mount electrical interconnect
#21 | 2013-08-29 ✅ Patent 9,232,654 granted on 2016-01-05High performance electrical circuit structure
#22 | 2013-08-15 ✅ Patent 9,276,339 granted on 2016-03-01Electrical interconnect IC device socket
#23 | 2013-08-15 ✅ Patent 9,320,133 granted on 2016-04-19Electrical interconnect IC device socket
#24 | 2013-08-08HIGH SPEED BACKPLANE CONNECTOR
#25 | 2013-05-02 ✅ Patent 9,184,145 granted on 2015-11-10Semiconductor device package adapter
#26 | 2013-03-28 ✅ Patent 9,184,527 granted on 2015-11-10Electrical connector insulator housing
#27 | 2012-10-25 ✅ Patent 8,928,344 granted on 2015-01-06Compliant printed circuit socket diagnostic tool
#28 | 2012-09-27 ✅ Patent 9,196,980 granted on 2015-11-24High performance surface mount electrical interconnect with external biased normal force loading
#29 | 2012-08-09 ✅ Patent 8,525,346 granted on 2013-09-03Compliant conductive nano-particle electrical interconnect
#30 | 2012-08-09 ✅ Patent 8,610,265 granted on 2013-12-17Compliant core peripheral lead semiconductor test socket
#31 | 2012-07-19 ✅ Patent 8,988,093 granted on 2015-03-24Bumped semiconductor wafer or die level electrical interconnect
#32 | 2012-07-05 ✅ Patent 8,758,067 granted on 2014-06-24Selective metalization of electrical connector or socket housing
#33 | 2012-07-05 ✅ Patent 8,987,886 granted on 2015-03-24Copper pillar full metal via electrical circuit structure
#34 | 2012-06-28 ✅ Patent 9,276,336 granted on 2016-03-01Metalized pad to electrical contact interface
#35 | 2012-06-28 ✅ Patent 9,613,841 granted on 2017-04-04Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
#36 | 2012-03-22 ✅ Patent 8,803,539 granted on 2014-08-12Compliant wafer level probe assembly
#37 | 2012-03-15 ✅ Patent 8,912,812 granted on 2014-12-16Compliant printed circuit wafer probe diagnostic tool
#38 | 2012-03-15 ✅ Patent 8,981,568 granted on 2015-03-17Simulated wirebond semiconductor package
#39 | 2012-03-15 ✅ Patent 9,054,097 granted on 2015-06-09Compliant printed circuit area array semiconductor device package
#40 | 2012-03-08 ✅ Patent 8,984,748 granted on 2015-03-24Singulated semiconductor device separable electrical interconnect
#41 | 2012-03-08 ✅ Patent 8,981,809 granted on 2015-03-17Compliant printed circuit semiconductor tester interface
#42 | 2012-03-08 ✅ Patent 9,136,196 granted on 2015-09-15Compliant printed circuit wafer level semiconductor package
#43 | 2012-03-08 ✅ Patent 9,414,500 granted on 2016-08-09Compliant printed flexible circuit
#44 | 2012-03-08 ✅ Patent 8,955,215 granted on 2015-02-17High performance surface mount electrical interconnect
#45 | 2012-03-01 ✅ Patent 9,320,144 granted on 2016-04-19Method of forming a semiconductor socket
#46 | 2012-03-01 ✅ Patent 8,789,272 granted on 2014-07-29Method of making a compliant printed circuit peripheral lead semiconductor test socket
#47 | 2012-03-01 ✅ Patent 8,970,031 granted on 2015-03-03Semiconductor die terminal
#48 | 2012-02-23 ✅ Patent 8,955,216 granted on 2015-02-17Method of making a compliant printed circuit peripheral lead semiconductor package
#49 | 2012-02-23 ✅ Patent 8,618,649 granted on 2013-12-31Compliant printed circuit semiconductor package
#50 | 2012-02-23 ✅ Patent 9,231,328 granted on 2016-01-05Resilient conductive electrical interconnect
#51 | 2012-02-23 ✅ Patent 9,277,654 granted on 2016-03-01Composite polymer-metal electrical contacts
Also check out HSIO Technologies, LLC's (Maple Grove, United States) applicant profile with 18 patent applications submitted.
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