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Assignee profile:

Ohkuchi Materials Co., Ltd.

City:

Kagoshima

Country:

Japan

Published Applications:

Last publication date:

2024-11-07

Patent Grants:

Last grant date:

2020-11-24

Top Inventors for applications by Ohkuchi Materials Co., Ltd.

These are the the leading inventors for applications assigned to Ohkuchi Materials Co., Ltd.:

Keiichi Otaki 8 Isa, Japan
Kaoru Hishiki 7 Isa, Japan
Kotaro Tomeoka 7 Isa, Japan
Hidehiko Sasaki 7 Isa, Japan

Kaoru HISHIKI 5 Kagoshima, Japan
Ichinori IIDANI 4 Kagoshima, Japan
Ichinori Iidani 1 Isa, Japan
Jun FUKUZAKI 1 Kagoshima, Japan

Shigeru Hosomomi 1 Isa-shi, Japan
Satoshi KUBOTA 1 Kagoshima, Japan
Shigeru Hosomomi 1 Isa, Japan
Ryuuji OOKAWAUCHI 1 Kagoshima, Japan

Shunichi KIDOGUCHI 1 Kagoshima, Japan
Masaki YAMAGUCHI 1 Kagoshima, Japan
Kazunori IITANI 1 Kagoshima, Japan
Ryouichi YOSHIMOTO 1 Kagoshima, Japan

Naoki Haruzono 1 Isa, Japan

Recent patent applications by Ohkuchi Materials Co., Ltd.

Ohkuchi Materials Co., Ltd. based in Kagoshima, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-11-07

US20240371733A1

Electricity

LEAD FRAME

#2 | 2020-10-01 ✅ Patent 10,847,451 granted on 2020-11-24

US20200312753A1

Electricity

Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element

#3 | 2020-10-01 ✅ Patent 10,777,492 granted on 2020-09-15

US20200312752A1

Electricity

Substrate for mounting semiconductor element

#4 | 2020-09-24 ✅ Patent 11,062,983 granted on 2021-07-13

US20200303289A1

Electricity

Substrate for mounting semiconductor element

#5 | 2020-09-24 ✅ Patent 10,903,150 granted on 2021-01-26

US20200303288A1

Electricity

Lead frame

#6 | 2020-09-24 ✅ Patent 10,763,196 granted on 2020-09-01

US20200303287A1

Electricity

Lead frame

#7 | 2020-09-24 ✅ Patent 10,811,346 granted on 2020-10-20

US20200303286A1

Electricity

Lead frame

#8 | 2020-09-24 ✅ Patent 11,404,286 granted on 2022-08-02

US20200303210A1

Electricity

Lead frame

#9 | 2020-01-30 ✅ Patent 10,886,206 granted on 2021-01-05

US20200035889A1

Electricity

Lead frame, resin-equipped lead frame, optical semiconductor device, and method for manufacturing lead frame

#10 | 2019-05-09 ✅ Patent 10,763,202 granted on 2020-09-01

US20190139879A1

Electricity

Multi-row wiring member for semiconductor device and method for manufacturing the same

#11 | 2019-03-28 ✅ Patent 10,453,782 granted on 2019-10-22

US20190096793A1

Electricity

Multi-row wiring member for semiconductor device and method for manufacturing the same

#12 | 2019-03-21 ✅ Patent 10,312,187 granted on 2019-06-04

US20190088580A1

Electricity

Multi-row wiring member for semiconductor device and method for manufacturing the same

#13 | 2018-08-09 ✅ Patent 10,304,760 granted on 2019-05-28

US20180226327A1

Electricity

Lead frame and method for manufacturing the same

#14 | 2018-07-19 ✅ Patent 10,622,286 granted on 2020-04-14

US20180204787A1

Electricity

Lead frame and method for manufacturing the same

#15 | 2018-06-14 ✅ Patent 10,229,871 granted on 2019-03-12

US20180166368A1

Electricity

Lead frame

#16 | 2018-06-07 ✅ Patent 10,727,171 granted on 2020-07-28

US20180158760A1

Electricity

Lead frame

#17 | 2018-02-01 ✅ Patent 10,305,007 granted on 2019-05-28

US20180033933A1

Electricity

Multi-row LED wiring member and method for manufacturing the same

#18 | 2017-12-14 ✅ Patent 10,276,422 granted on 2019-04-30

US20170358477A1

Electricity

Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate

#19 | 2016-10-13 ✅ Patent 10,204,801 granted on 2019-02-12

US20160300732A1

Electricity

Method for producing substrate for semiconductor element mounting

Also check out Ohkuchi Materials Co., Ltd.'s (Kagoshima, Japan) applicant profile with 16 patent applications submitted.

AssigneeID:

163426 ⎘