Assignee profile:

Octavo Systems LLC

City:

Sugar Land, Texas

Country:

United States

Published Applications:

26

Last publication date:

2025-08-21

Patent Grants:

21

Last grant date:

2026-01-27

Top Inventors for applications by Octavo Systems LLC

These are the the leading inventors for applications assigned to Octavo Systems LLC:

Recent patent applications by Octavo Systems LLC

Octavo Systems LLC based in Sugar Land, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-08-21
US20250266266A1
Electricity

MOLDED PACKAGES IN A MOLDED DEVICE

#2 | 2025-07-03
US20250218798A1
Electricity

METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES

#3 | 2025-07-03
US20250216440A1
Physics

RELIABILITY TESTING USING FUNCTIONAL DEVICES

#4 | 2024-08-29 ✅ Patent 12,536,119 granted on 2026-01-27
US20240289290A1
Physics

SECURE ENCLAVE SYSTEM-IN-PACKAGE

#5 | 2024-08-08
US20240266243A1
Electricity

SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT

#6 | 2024-03-14 ✅ Patent 12,243,794 granted on 2025-03-04
US20240087975A1
Electricity

System in a package modifications

#7 | 2023-06-15 ✅ Patent 12,001,363 granted on 2024-06-04
US20230185748A1
Physics

Secure enclave system-in-package

#8 | 2022-12-08 ✅ Patent 12,535,839 granted on 2026-01-27
US20220390970A1
Physics

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

#9 | 2022-01-27
US20220028704A1
Electricity

MOLDED PACKAGES IN A MOLDED DEVICE

#10 | 2021-05-13 ✅ Patent 11,869,823 granted on 2024-01-09
US20210143075A1
Electricity

System in a package modifications

#11 | 2021-03-11 ✅ Patent 11,347,478 granted on 2022-05-31
US20210072958A1
Physics

Analog arithmetic unit

#12 | 2020-12-24 ✅ Patent 11,171,651 granted on 2021-11-09
US20200403618A1
Electricity

Mixed signal computer

#13 | 2020-12-24 ✅ Patent 11,373,720 granted on 2022-06-28
US20200402601A1
Physics

Analog memory cells with valid flag

#14 | 2020-09-24 ✅ Patent 11,302,648 granted on 2022-04-12
US20200303321A1
Electricity

EMI shield for molded packages

#15 | 2020-07-30 ✅ Patent 11,610,844 granted on 2023-03-21
US20200243451A1
Electricity

High performance module for SiP

#16 | 2020-04-30 ✅ Patent 11,308,290 granted on 2022-04-19
US20200134268A1
Physics

Mixed signal computer architecture

#17 | 2020-02-27 ✅ Patent 11,257,803 granted on 2022-02-22
US20200066702A1
Electricity

System in a package connectors

#18 | 2020-02-20 ✅ Patent 11,309,056 granted on 2022-04-19
US20200058364A1
Physics

Automatic test equipment method for testing system in a package devices

#19 | 2019-11-14 ✅ Patent 11,157,676 granted on 2021-10-26
US20190347378A1
Physics

Method for routing bond wires in system in a package (SiP) devices

#20 | 2019-09-05 ✅ Patent 11,211,369 granted on 2021-12-28
US20190273073A1
Electricity

Service module for SIP devices

#21 | 2019-07-04 ✅ Patent 11,502,030 granted on 2022-11-15
US20190206779A1
Electricity

System and method of assembling a system

#22 | 2019-04-18 ✅ Patent 10,867,979 granted on 2020-12-15
US20190115331A1
Electricity

Circuit mounting structure and lead frame for system in package (SIP) devices

#23 | 2019-03-07 ✅ Patent 11,171,126 granted on 2021-11-09
US20190074268A1
Electricity

Configurable substrate and systems

#24 | 2019-01-24 ✅ Patent 10,714,430 granted on 2020-07-14
US20190027443A1
Electricity

EMI shield for molded packages

#25 | 2018-11-08 ✅ Patent 11,416,050 granted on 2022-08-16
US20180321313A1
Physics

Component communications in system-in-package systems

#26 | 2018-11-01 ✅ Patent 11,032,910 granted on 2021-06-08
US20180317323A1
Electricity

System-in-Package device ball map and layout optimization

Also check out OCTAVO SYSTEMS LLC's (Sugar Land, United States) applicant profile with 24 patent applications submitted.

AssigneeID:

163427 ⎘