Sugar Land, Texas
United States
26
2025-08-21
21
2026-01-27
These are the the leading inventors for applications assigned to Octavo Systems LLC:
Octavo Systems LLC based in Sugar Land, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
MOLDED PACKAGES IN A MOLDED DEVICE
#2 | 2025-07-03METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES
#3 | 2025-07-03RELIABILITY TESTING USING FUNCTIONAL DEVICES
#4 | 2024-08-29 ✅ Patent 12,536,119 granted on 2026-01-27SECURE ENCLAVE SYSTEM-IN-PACKAGE
#5 | 2024-08-08SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT
#6 | 2024-03-14 ✅ Patent 12,243,794 granted on 2025-03-04System in a package modifications
#7 | 2023-06-15 ✅ Patent 12,001,363 granted on 2024-06-04Secure enclave system-in-package
#8 | 2022-12-08 ✅ Patent 12,535,839 granted on 2026-01-27COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
#9 | 2022-01-27MOLDED PACKAGES IN A MOLDED DEVICE
#10 | 2021-05-13 ✅ Patent 11,869,823 granted on 2024-01-09System in a package modifications
#11 | 2021-03-11 ✅ Patent 11,347,478 granted on 2022-05-31Analog arithmetic unit
#12 | 2020-12-24 ✅ Patent 11,171,651 granted on 2021-11-09Mixed signal computer
#13 | 2020-12-24 ✅ Patent 11,373,720 granted on 2022-06-28Analog memory cells with valid flag
#14 | 2020-09-24 ✅ Patent 11,302,648 granted on 2022-04-12EMI shield for molded packages
#15 | 2020-07-30 ✅ Patent 11,610,844 granted on 2023-03-21High performance module for SiP
#16 | 2020-04-30 ✅ Patent 11,308,290 granted on 2022-04-19Mixed signal computer architecture
#17 | 2020-02-27 ✅ Patent 11,257,803 granted on 2022-02-22System in a package connectors
#18 | 2020-02-20 ✅ Patent 11,309,056 granted on 2022-04-19Automatic test equipment method for testing system in a package devices
#19 | 2019-11-14 ✅ Patent 11,157,676 granted on 2021-10-26Method for routing bond wires in system in a package (SiP) devices
#20 | 2019-09-05 ✅ Patent 11,211,369 granted on 2021-12-28Service module for SIP devices
#21 | 2019-07-04 ✅ Patent 11,502,030 granted on 2022-11-15System and method of assembling a system
#22 | 2019-04-18 ✅ Patent 10,867,979 granted on 2020-12-15Circuit mounting structure and lead frame for system in package (SIP) devices
#23 | 2019-03-07 ✅ Patent 11,171,126 granted on 2021-11-09Configurable substrate and systems
#24 | 2019-01-24 ✅ Patent 10,714,430 granted on 2020-07-14EMI shield for molded packages
#25 | 2018-11-08 ✅ Patent 11,416,050 granted on 2022-08-16Component communications in system-in-package systems
#26 | 2018-11-01 ✅ Patent 11,032,910 granted on 2021-06-08System-in-Package device ball map and layout optimization
Also check out OCTAVO SYSTEMS LLC's (Sugar Land, United States) applicant profile with 24 patent applications submitted.
163427 ⎘