Bondcore OU

City:

Tallinn

Country:

Estonia

Published Applications:

Last publication date:

2020-10-08

Patent Grants:

Last grant date:

2022-05-03

Top Inventors for applications by Bondcore OU

These are the the leading inventors for applications assigned to Bondcore OU:

RONALD J. BATTY 1 Perth, Canada

Recent patent applications by Bondcore OU

Bondcore OU based in Tallinn, EE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-10-08 ✅ Patent 11,318,636 granted on 2022-05-03

US20200316813A1

Performing operations; transporting

Composite wood panels with corrugated cores and method of manufacturing same

Also check out Bondcore OU's (Tallinn, Estonia) applicant profile with 1 patent applications submitted.

AssigneeID:

163845 ⎘