QMAT, Inc.

City:

Santa Clara, California

Country:

United States

Published Applications:

Last publication date:

2019-09-19

Patent Grants:

Last grant date:

2018-12-25

Top Inventors for applications by QMAT, Inc.

These are the the leading inventors for applications assigned to QMAT, Inc.:

Francois J. HENLEY 4 Saratoga, CA United States
Sien Kang 2 Dublin, CA United States
Minghang LI 2 Fremont, CA United States
Mingyu ZHONG 2 Union City, CA United States

Recent patent applications by QMAT, Inc.

QMAT, Inc. based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-09-19

US20190288158A1

Electricity

SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXY

#2 | 2018-02-08 ✅ Patent 10,164,144 granted on 2018-12-25

US20180040765A1

Electricity

Bond and release layer transfer process

#3 | 2018-02-08 ✅ Patent 10,186,630 granted on 2019-01-22

US20180040764A1

Electricity

Seed wafer for GaN thickening using gas- or liquid-phase epitaxy

#4 | 2016-12-22 ✅ Patent 9,859,458 granted on 2018-01-02

US20160372628A1

Electricity

Bond and release layer transfer process

Also check out QMAT, Inc.'s (Santa Clara, United States) applicant profile with 3 patent applications submitted.

AssigneeID:

170313 ⎘