THIN MATERIALS AG

City:

Eichenau

Country:

Germany

Published Applications:

Last publication date:

2012-02-02

Patent Grants:

Last grant date:

2015-02-10

Top Inventors for applications by THIN MATERIALS AG

These are the the leading inventors for applications assigned to THIN MATERIALS AG:

Franz Richter 2 Eichenau, Germany
Andreas Jakob 1 Starnberg, Germany

Recent patent applications by THIN MATERIALS AG

THIN MATERIALS AG based in Eichenau, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-02-02 ✅ Patent 8,951,886 granted on 2015-02-10

US20120028438A1

Electricity

Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front

#2 | 2011-11-10 ✅ Patent 8,641,859 granted on 2014-02-04

US20110272092A1

Electricity

Bonding method

#3 | 2010-02-25 ✅ Patent 8,911,583 granted on 2014-12-16

US20100043608A1

Electricity

Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement

AssigneeID:

175576 ⎘