Daejeon-si
South Korea
12
2012-03-15
10
2014-09-30
These are the the leading inventors for applications assigned to HANVISION CO., LTD:
HANVISION CO., LTD based in Daejeon-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor for sensing infrared radiation and method thereof
#2 | 2011-09-08 ✅ Patent 8,183,079 granted on 2012-05-22Semiconductor device and method of manufacturing the same
#3 | 2011-07-143D IMAGE SENSOR AND STEREOSCOPIC CAMERA HAVING THE SAME
#4 | 2011-03-17 ✅ Patent 8,232,127 granted on 2012-07-31Thermo-electric semiconductor device and method for manufacturing the same
#5 | 2010-12-23 ✅ Patent 7,943,409 granted on 2011-05-17Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereof
#6 | 2010-07-22 ✅ Patent 8,063,370 granted on 2011-11-22Semiconductor device and method of manufacturing the same
#7 | 2010-05-13 ✅ Patent 8,039,797 granted on 2011-10-18Semiconductor for sensing infrared radiation and method thereof
#8 | 2010-05-06 ✅ Patent 7,977,718 granted on 2011-07-12Image sensor photodiodes using a multi-layer substrate and contact method and structure thereof
#9 | 2010-03-25THERMO-ELECTRIC SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#10 | 2010-02-18 ✅ Patent 7,723,686 granted on 2010-05-25Image sensor for detecting wide spectrum and method of manufacturing the same
#11 | 2008-08-07 ✅ Patent 7,838,318 granted on 2010-11-23Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereof
#12 | 2008-07-03 ✅ Patent 7,977,145 granted on 2011-07-12Method of fabricating silicon/dielectric multi-layer semiconductor structures using layer transfer technology and also a three-dimensional multi-layer semiconductor device and stacked layer type image sensor using the same method, and a method of manufacturing a three-dimensional multi-layer semiconductor device and the stack type image sensor
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