EVEC INCORPORATED

City:

Sapporo-shi, Hokkaido

Country:

Japan

Published Applications:

Last publication date:

2012-04-19

Patent Grants:

Last grant date:

2013-07-23

Top Inventors for applications by EVEC INCORPORATED

These are the the leading inventors for applications assigned to EVEC INCORPORATED:

Kenzo Takada 1 Sapporo-shi, Hokkaido, Japan
Rika Kurino 1 Hokkaido, Japan
Takashi Torashima 1 Hokkaido, Japan
Kenzo Takada 1 Hokkaido, Japan

Hironori Yoshiyama 1 Sapporo-shi, Hokkaido, Japan

Recent patent applications by EVEC INCORPORATED

EVEC INCORPORATED based in Sapporo-shi, Hokkaido, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-04-19 ✅ Patent 8,492,529 granted on 2013-07-23

US20120093810A1

Chemistry; metallurgy

Monoclonal antibody capable of binding to specific discontinuous epitope occurring in AD1 region of human cytomegalovirus GB glycoprotein, and antigen-binding fragment thereof

#2 | 2006-08-31

US20060194203A1

Chemistry; metallurgy

Packing cell system for eb virus vector

AssigneeID:

180524 ⎘