Bondtech, Inc.

City:

Kyoto

Country:

Japan

Published Applications:

Last publication date:

2012-05-03

Patent Grants:

Last grant date:

2014-02-18

Top Inventors for applications by Bondtech, Inc.

These are the the leading inventors for applications assigned to Bondtech, Inc.:

Masuaki Okada 5 Osaka, Japan
Tadatomo Suga 3 Tokyo, Japan

Recent patent applications by Bondtech, Inc.

Bondtech, Inc. based in Kyoto, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-05-03 ✅ Patent 8,651,363 granted on 2014-02-18

US20120104076A1

Physics

Joining method and device produced by this method and joining unit

#2 | 2010-10-07 ✅ Patent 8,091,764 granted on 2012-01-10

US20100252615A1

Physics

Joining method and device produced by this method and joining unit

#3 | 2008-10-09 ✅ Patent 7,784,670 granted on 2010-08-31

US20080245843A1

Physics

Joining method and device produced by this method and joining unit

#4 | 2007-05-17 ✅ Patent 7,645,681 granted on 2010-01-12

US20070111471A1

Chemistry; metallurgy

Bonding method, device produced by this method, and bonding device

#5 | 2007-05-17

US20070110917A1

Electricity

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

AssigneeID:

181375 ⎘