SEED LAYERS TECHNOLOGY, LLC

City:

SUFFERN, New York

Country:

United States

Published Applications:

Last publication date:

2012-05-24

Patent Grants:

Last grant date:

2013-11-19

Top Inventors for applications by SEED LAYERS TECHNOLOGY, LLC

These are the the leading inventors for applications assigned to SEED LAYERS TECHNOLOGY, LLC:

Uri Cohen 2 Palo Alto, CA United States

Recent patent applications by SEED LAYERS TECHNOLOGY, LLC

SEED LAYERS TECHNOLOGY, LLC based in SUFFERN, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-05-24 ✅ Patent 8,586,471 granted on 2013-11-19

US20120126409A1

Electricity

Seed layers for metallic interconnects and products

#2 | 2011-03-24 ✅ Patent 8,123,861 granted on 2012-02-28

US20110068470A1

Electricity

Apparatus for making interconnect seed layers and products

AssigneeID:

183013 ⎘