Osaka
Japan
7
2019-05-09
7
2020-04-07
These are the the leading inventors for applications assigned to Kaken Tech Co., Ltd.:
Kaken Tech Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Conductive paste and die bonding method
#2 | 2016-04-28 ✅ Patent 10,071,420 granted on 2018-09-11Flake-like silver powder, conductive paste, and method for producing flake-like silver powder
#3 | 2015-04-30 ✅ Patent 9,818,718 granted on 2017-11-14Conductive paste and die bonding method
#4 | 2013-04-18 ✅ Patent 9,085,751 granted on 2015-07-21Liquid concentrate for cleaning composition, cleaning composition and cleaning method
#5 | 2008-12-11 ✅ Patent 7,776,808 granted on 2010-08-17Cleaning agent for removing solder flux and method for cleaning solder flux
#6 | 2006-10-12 ✅ Patent 7,799,408 granted on 2010-09-21Conductive powder, conductive composition, and producing method of the same
#7 | 2006-10-05 ✅ Patent 7,435,711 granted on 2008-10-14Cleaning agent for removing solder flux and method for cleaning solder flux
Also check out KAKEN TECH CO., LTD.'s (Osaka, Japan) applicant profile with 3 patent applications submitted.
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