Taipei City
Taiwan
60
2014-01-16
16
2013-07-02
These are the the leading inventors for applications assigned to Forward Electronics Co., Ltd.:
Forward Electronics Co., Ltd. based in Taipei City, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
DYNAMIC DIFFRACTIVE IMAGE PROJECTION DEVICE
#2 | 2013-07-25PHOTO-STIMULATION METHOD AND DEVICE WITH LIGHT MIXTURE
#3 | 2013-07-25PHOTO-STIMULATION METHOD AND DEVICE
#4 | 2013-07-25PHOTO-STIMULATION METHOD AND KIT WITH AGONIST AGENT
#5 | 2013-04-18PHOTOTHERAPY DEVICE
#6 | 2012-11-08 ✅ Patent 8,478,396 granted on 2013-07-02Phototherapy patch
#7 | 2012-11-08COATING APPARATUS AND METHOD FOR REAL-TIMELY MONITORING THICKNESS CHANGE OF COATING FILM
#8 | 2012-07-12 ✅ Patent 8,440,925 granted on 2013-05-14Encoder with tri-color LED
#9 | 2012-07-05Tri-color LED module structure
#10 | 2012-06-07SPR optical fiber sensor and SPR sensing device using the same
#11 | 2012-05-17LED package structure
#12 | 2012-03-29LED package structure
#13 | 2012-01-19Phosphor composition for AC LEDS and AC LED manufactured with the same
#14 | 2011-12-15Phototherapy device
#15 | 2011-12-15Phototherapy patch
#16 | 2011-08-18Led lead frame structure
#17 | 2011-08-04 ✅ Patent 8,278,680 granted on 2012-10-02Semiconductor package structure
#18 | 2011-07-14SURFACE-MODIFIED SENSOR DEVICE AND METHOD FOR SURFACE-MODIFYING THE SAME
#19 | 2011-06-30 ✅ Patent 8,149,413 granted on 2012-04-03Surface plasmon resonance sensing device
#20 | 2011-06-23 ✅ Patent 8,377,503 granted on 2013-02-19Method for real-time monitoring thickness chance of coating film
#21 | 2011-05-26LED package structure
#22 | 2011-05-26 ✅ Patent 8,148,739 granted on 2012-04-03LED package structure
#23 | 2011-05-12Method for forming LED phosphor resin layer
#24 | 2011-04-21 ✅ Patent 8,143,633 granted on 2012-03-27LED package structure and manufacturing process thereof
#25 | 2011-04-21Packaging Structure of AC light-emitting diodes
#26 | 2011-04-14High reliability and long lifetime AC LED device
#27 | 2011-03-17Microfluidic detection device and method for detecting molecules using the same
#28 | 2011-03-17Method of improving optical sensor
#29 | 2011-02-03High-efficiency LED
#30 | 2011-01-27AC LED device for eliminating harmonic current
#31 | 2011-01-27AC LED device for avoiding harmonic current and flash
#32 | 2010-10-28AC LED package structure
#33 | 2010-09-16LED package structure
#34 | 2010-09-09 ✅ Patent 8,373,353 granted on 2013-02-12Alternating current light emitting diode device
#35 | 2010-05-06 ✅ Patent 8,104,924 granted on 2012-01-31LED diaphragm structure
#36 | 2009-10-08Backlight Module
#37 | 2009-04-30Method for biomolecule immobilization
#38 | 2009-04-23SURFACE PLASMON RESONANCE FIBER SENSOR
#39 | 2008-12-18 ✅ Patent 7,866,202 granted on 2011-01-11Method of fabricating a carbon monoxide detector and a carbon monoxide detector fabricated using the same
#40 | 2008-07-17DIRECT TYPE BACKLIGHT MODULE
#41 | 2008-03-06 ✅ Patent 7,737,946 granted on 2010-06-15Mouse with a two-way movable cover module
#42 | 2008-02-14Flat field emission illumination module
#43 | 2007-11-29Mouse with a caterpillar track type wheel
#44 | 2007-09-27Lamp apparatus with alarm function
#45 | 2007-07-05Surface plasmon resonance detector
#46 | 2007-06-21Humidity sensor and method for making the same
#47 | 2006-12-21Computer mouse with noiseless button
#48 | 2006-09-28Dewing sensor
#49 | 2006-06-22 ✅ Patent 7,168,819 granted on 2007-01-30Backlight module having light diffusing device
#50 | 2006-06-22Backlight module having light diffusing device
#51 | 2006-05-25 ✅ Patent 7,273,092 granted on 2007-09-25Modularized cooler
#52 | 2006-05-25 ✅ Patent 7,316,266 granted on 2008-01-08Liquid-cooled pipe
#53 | 2006-05-04Heat-exchange type cooler
#54 | 2006-05-04 ✅ Patent 7,278,467 granted on 2007-10-09Liquid-cooled heat radiator kit
#55 | 2006-04-13 ✅ Patent 7,147,042 granted on 2006-12-12Heat collector
#56 | 2005-10-06Memory mouse
#57 | 2005-08-18Liquid tank for use in a liquid-cooling type cooling apparatus
#58 | 2005-08-18Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus
#59 | 2005-08-18Heat absorber and its fabrication
#60 | 2005-08-18Heat absorber and its fabrication
Also check out FORWARD ELECTRONICS CO., LTD.'s (Taipei City, Taiwan) applicant profile with 3 patent applications submitted.
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