Barfold, Inc.

City:

Boulder, Colorado

Country:

United States

Published Applications:

Last publication date:

2012-09-27

Patent Grants:

Last grant date:

2014-08-12

Top Inventors for applications by Barfold, Inc.

These are the the leading inventors for applications assigned to Barfold, Inc.:

Theodore W. Randolph 1 Niwot, CO United States
Matthew B. Seefeldt 1 Denver, CO United States
Robert Nelson 1 Arvada, CO United States
Lyndal K. Hesterberg 1 Boulder, CO United States

Recent patent applications by Barfold, Inc.

Barfold, Inc. based in Boulder, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-09-27 ✅ Patent 8,802,828 granted on 2014-08-12

US20120245329A1

Chemistry; metallurgy

High pressure refolding of monoclonal antibody aggregates

AssigneeID:

190826 ⎘