EBARA-UDYLITE CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2011-03-17

Patent Grants:

Last grant date:

2018-07-10

Top Inventors for applications by EBARA-UDYLITE CO., LTD.

These are the the leading inventors for applications assigned to EBARA-UDYLITE CO., LTD.:

Makoto KOHTOKU 2 Kanagawa, Japan
Ryoichi Kimizuka 2 Kanagawa, Japan
Mika Hamada 2 Kanagawa, Japan
Tsuyoshi Sahoda 2 Tokyo, Japan

Tsutomu Nakada 2 Tokyo, Japan
Takeshi KOBAYASHI 2 Kanagawa, Japan
Koji MISHIMA 2 Tokyo, Japan
Makoto Kohtoku 1 Kawasaki, Japan

Shinya OCHI 1 Ehime, Japan
Ryuichi Nakagami 1 Ehime, Japan
Satoru Shimizu 1 Kanagawa, Japan
Mika Hamada 1 Kawasaki, Japan

Recent patent applications by EBARA-UDYLITE CO., LTD.

EBARA-UDYLITE CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-03-17

US20110064954A1

Chemistry; metallurgy

METHOD FOR CONDITIONING INSULATING RESIN AND ITS USE

#2 | 2010-07-29 ✅ Patent 10,021,789 granted on 2018-07-10

US20100189974A1

Electricity

Metal-laminated polyimide substrate, and method for production thereof

#3 | 2010-02-25 ✅ Patent 8,354,014 granted on 2013-01-15

US20100047458A1

Performing operations; transporting

Palladium complex and catalyst-imparting treatment solution using the same

#4 | 2008-10-30

US20080264798A1

Chemistry; metallurgy

Copper Plating Bath and Plating Method

#5 | 2005-04-07

US20050072683A1

Chemistry; metallurgy

Copper plating bath and plating method

AssigneeID:

199088 ⎘