Assignee profile:

OKI SEMICONDUCTOR CO., LTD.

City:

Kanagawa

Country:

Japan

Published Applications:

12

Last publication date:

2011-11-24

Patent Grants:

11

Last grant date:

2013-07-16

Top Inventors for applications by OKI SEMICONDUCTOR CO., LTD.

These are the the leading inventors for applications assigned to OKI SEMICONDUCTOR CO., LTD.:

Recent patent applications by OKI SEMICONDUCTOR CO., LTD.

OKI SEMICONDUCTOR CO., LTD. based in Kanagawa, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-11-24 ✅ Patent 8,486,728 granted on 2013-07-16
US20110287585A1
Electricity

Semiconductor device including semiconductor elements mounted on base plate

#2 | 2011-08-18 ✅ Patent 8,664,666 granted on 2014-03-04
US20110201178A1
Electricity

Semiconductor device and process for fabricating the same

#3 | 2011-08-04 ✅ Patent 8,298,920 granted on 2012-10-30
US20110189798A1
Electricity

Chip ID applying method suitable for use in semiconductor integrated circuit

#4 | 2011-07-14 ✅ Patent 8,409,930 granted on 2013-04-02
US20110171779A1
Electricity

Semiconductor device manufacturing method

#5 | 2011-03-24 ✅ Patent 7,983,360 granted on 2011-07-19
US20110069771A1
Electricity

OFDM receiver and doppler frequency estimating circuit

#6 | 2011-01-13 ✅ Patent 8,164,164 granted on 2012-04-24
US20110006438A1
Electricity

Semiconductor wafer, and semiconductor device formed therefrom

#7 | 2010-12-23
US20100321419A1
Physics

DRIVER FOR DISPLAY PANEL

#8 | 2010-10-28 ✅ Patent 8,786,087 granted on 2014-07-22
US20100270675A1
Electricity

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate

#9 | 2010-09-23 ✅ Patent 8,076,220 granted on 2011-12-13
US20100240195A1
Electricity

Fabrication method for device structure having transparent dielectric substrate

#10 | 2010-08-05 ✅ Patent 8,008,129 granted on 2011-08-30
US20100197079A1
Electricity

Method of making semiconductor device packaged by sealing resin member

#11 | 2010-06-03 ✅ Patent 8,030,162 granted on 2011-10-04
US20100136760A1
Electricity

Silicon carbide semiconductor device and manufacturing method thereof

#12 | 2008-09-18 ✅ Patent 7,679,132 granted on 2010-03-16
US20080224149A1
Electricity

Silicon carbide semiconductor device and manufacturing method thereof

AssigneeID:

204223 ⎘