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Assignee profile:

ARIMA OPTOELECTRONICS CORP.

City:

TAOYUAN COUNTY

Country:

Taiwan

Published Applications:

Last publication date:

2011-10-06

Patent Grants:

Last grant date:

2012-05-01

Top Inventors for applications by ARIMA OPTOELECTRONICS CORP.

These are the the leading inventors for applications assigned to ARIMA OPTOELECTRONICS CORP.:

Ying-Che SUNG 3 Taoyuan County, Taiwan
Hsien-Cheng Yen 2 Dashi, Taiwan
Hsien-Cheng Yen 2 Taoyuan County, Taiwan
Shih-Yu Chiu 2 Dashi, Taiwan

Pan-Tzu Chang 2 Hsinchu County, Taiwan
Yi-Hsiung Chen 2 Dashi, Taiwan
HUI-HENG WANG 2 TAOYUAN COUNTY, Taiwan
Chao-Hsin Wang 2 Dashi, Taiwan

Ying-Che Sung 2 Dashi, Taiwan
Szutsun Simoun-Ou 1 Dashi, Taiwan
Pei-Jih Wang 1 Taoyuan County, Taiwan
Yung-Chung Sung 1 Dashi, Taiwan

Rupert Wu 1 Dashi, Taiwan
Chang-Yao Lin 1 Dashi, Taiwan
Pei-Jih Wang 1 Dashi, Taiwan
Szutsun Simoun-Ou 1 Taoyuan County, Taiwan

Yuh Wen Lee 1 Taoyuan, Taiwan
Chih-Ming Hsu 1 Taoyuan, Taiwan
Rupert Wu 1 Taoyuan county, Taiwan
Ren-Cheng Chao 1 Dashi, Taiwan

Shih-Yu Chiu 1 Taoyuan County, Taiwan
Chao-Hsin Wang 1 Taoyuan County, Taiwan
Chun-Ting Lin 1 Dashi, Taiwan
Yi-Hsiung Chen 1 Taoyuan County, Taiwan

Chun-Ting Lin 1 Taoyuan County, Taiwan

Recent patent applications by ARIMA OPTOELECTRONICS CORP.

ARIMA OPTOELECTRONICS CORP. based in TAOYUAN COUNTY, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-10-06

US20110241059A1

Electricity

LED DIE STRUCTURE AND METHOD FOR MANUFACTURING THE BOTTOM TERMINAL THEREOF

#2 | 2010-10-21 ✅ Patent 8,169,086 granted on 2012-05-01

US20100264453A1

Electricity

Semiconductor chip pad structure and method for manufacturing the same

#3 | 2009-08-20 ✅ Patent 7,781,755 granted on 2010-08-24

US20090206362A1

Electricity

Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diode

#4 | 2009-07-23 ✅ Patent 7,677,782 granted on 2010-03-16

US20090185372A1

Mechanical engineering

LED flat lamp

#5 | 2007-08-23 ✅ Patent 7,704,770 granted on 2010-04-27

US20070194325A1

Electricity

Light emitting diode by use of metal diffusion bonding technology and method of producing light emitting diode

#6 | 2007-03-01 ✅ Patent 7,199,390 granted on 2007-04-03

US20070045608A1

Electricity

Window interface layer of a light-emitting diode

#7 | 2006-12-14 ✅ Patent 7,397,182 granted on 2008-07-08

US20060279674A1

Physics

Display module using blue-ray or ultraviolet-ray light sources

#8 | 2006-06-01 ✅ Patent 7,177,331 granted on 2007-02-13

US20060114950A1

Electricity

Laser diode module with a built-in high-frequency modulation IC

#9 | 2005-11-03

US20050244992A1

Electricity

Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereof

#10 | 2005-05-19 ✅ Patent 7,177,333 granted on 2007-02-13

US20050105572A1

Electricity

Laser diode device with an APC inside the cap

#11 | 2005-04-07

US20050072983A1

Electricity

Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereof

AssigneeID:

206569 ⎘