DEFOND COMPONENTS LIMITED

City:

Chai Wan

Country:

China

Published Applications:

Last publication date:

2011-11-03

Patent Grants:

Last grant date:

2014-12-16

Top Inventors for applications by DEFOND COMPONENTS LIMITED

These are the the leading inventors for applications assigned to DEFOND COMPONENTS LIMITED:

Man Yin Arthur Newton Chu 1 Aberdeen, Hong Kong
Chi Leung Lai 1 Hong Kong, China
Chi Leung Lai 1 Chai Wan, China

Recent patent applications by DEFOND COMPONENTS LIMITED

DEFOND COMPONENTS LIMITED based in Chai Wan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-11-03 ✅ Patent 8,910,822 granted on 2014-12-16

US20110266282A1

Electricity

Method of forming sealed enclosure

#2 | 2008-03-06 ✅ Patent 7,468,492 granted on 2008-12-23

US20080053804A1

Electricity

Electrical switch

Also check out Defond Components Limited's (Chai Wan, China) applicant profile with 1 patent applications submitted.

AssigneeID:

207789 ⎘