Hamilton
Bermuda
85
2011-12-08
76
2012-09-18
These are the the leading inventors for applications assigned to CHIPMOS TECHNOLOGIES (BERMUDA) LTD.:
CHIPMOS TECHNOLOGIES (BERMUDA) LTD. based in Hamilton, BM has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Manufacturing method of bump structure with annular support
#2 | 2011-07-28 ✅ Patent 8,426,245 granted on 2013-04-23Packaging method involving rearrangement of dice
#3 | 2011-07-28 ✅ Patent 8,431,437 granted on 2013-04-30Packaging method involving rearrangement of dice
#4 | 2010-12-16 ✅ Patent 8,207,603 granted on 2012-06-26Stacked chip package structure with leadframe having inner leads with transfer pad
#5 | 2010-10-21 ✅ Patent 8,169,061 granted on 2012-05-01Stacked chip package structure with leadframe having bus bar
#6 | 2010-10-21 ✅ Patent 8,212,347 granted on 2012-07-03Stacked chip package structure with leadframe having bus bar
#7 | 2010-09-30 ✅ Patent 8,237,249 granted on 2012-08-07Stacked multichip package
#8 | 2010-08-12 ✅ Patent 7,952,198 granted on 2011-05-31BGA package with leads on chip
#9 | 2010-07-29 ✅ Patent 7,919,874 granted on 2011-04-05Chip package without core and stacked chip package structure
#10 | 2010-07-29CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE
#11 | 2010-07-15 ✅ Patent 7,879,653 granted on 2011-02-01Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#12 | 2010-06-24 ✅ Patent 7,888,783 granted on 2011-02-15Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers
#13 | 2010-06-17 ✅ Patent 7,981,725 granted on 2011-07-19Fabricating process of a chip package structure
#14 | 2010-05-27 ✅ Patent 7,843,054 granted on 2010-11-30Chip package and manufacturing method thereof
#15 | 2010-04-08 ✅ Patent 7,915,690 granted on 2011-03-29Die rearrangement package structure using layout process to form a compliant configuration
#16 | 2010-04-01 ✅ Patent 8,039,946 granted on 2011-10-18Chip package structure and fabricating method thereof
#17 | 2009-12-10 ✅ Patent 7,888,172 granted on 2011-02-15Chip stacked structure and the forming method
#18 | 2009-11-12 ✅ Patent 8,088,650 granted on 2012-01-03Method of fabricating chip package
#19 | 2009-10-01 ✅ Patent 7,834,432 granted on 2010-11-16Chip package having asymmetric molding
#20 | 2009-09-24 ✅ Patent 7,700,412 granted on 2010-04-20Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers
#21 | 2009-08-20 ✅ Patent 8,421,223 granted on 2013-04-16Conductive structure for a semiconductor integrated circuit
#22 | 2009-08-06 ✅ Patent 7,741,149 granted on 2010-06-22Method of fabricating chip package structure
#23 | 2009-06-25 ✅ Patent 7,662,667 granted on 2010-02-16Die rearrangement package structure using layout process to form a compliant configuration
#24 | 2009-06-25 ✅ Patent 7,927,922 granted on 2011-04-19Dice rearrangement package structure using layout process to form a compliant configuration
#25 | 2009-05-21 ✅ Patent 7,648,902 granted on 2010-01-19Manufacturing method of redistribution circuit structure
#26 | 2009-03-12 ✅ Patent 7,795,079 granted on 2010-09-14Manufacturing process for a quad flat non-leaded chip package structure
#27 | 2009-03-12MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE
#28 | 2009-03-12 ✅ Patent 7,803,667 granted on 2010-09-28Manufacturing process for a quad flat non-leaded chip package structure
#29 | 2009-03-12 ✅ Patent 7,790,514 granted on 2010-09-07Manufacturing process for a chip package structure
#30 | 2009-03-12 ✅ Patent 7,851,270 granted on 2010-12-14Manufacturing process for a chip package structure
#31 | 2009-03-12 ✅ Patent 7,851,262 granted on 2010-12-14Manufacturing process for a chip package structure
#32 | 2009-03-12 ✅ Patent 7,964,940 granted on 2011-06-21Chip package with asymmetric molding
#33 | 2009-03-12 ✅ Patent 7,803,666 granted on 2010-09-28Manufacturing process for a Quad Flat Non-leaded chip package structure
#34 | 2009-02-19PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE
#35 | 2009-01-29CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF
#36 | 2008-12-25 ✅ Patent 7,851,896 granted on 2010-12-14Quad flat non-leaded chip package
#37 | 2008-12-18 ✅ Patent 7,638,880 granted on 2009-12-29Chip package
#38 | 2008-12-18CHIP PACKAGE
#39 | 2008-12-11 ✅ Patent 7,723,853 granted on 2010-05-25Chip package without core and stacked chip package structure
#40 | 2008-10-30 ✅ Patent 7,960,214 granted on 2011-06-14Chip package
#41 | 2008-10-30 ✅ Patent 7,749,806 granted on 2010-07-06Fabricating process of a chip package structure
#42 | 2008-10-16 ✅ Patent 7,847,414 granted on 2010-12-07Chip package structure
#43 | 2008-09-18CHIP PACKAGE STRUCTURE
#44 | 2008-08-14CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#45 | 2008-08-07 ✅ Patent 8,105,881 granted on 2012-01-31Method of fabricating chip package structure
#46 | 2008-08-07 ✅ Patent 7,683,462 granted on 2010-03-23Chip package structure
#47 | 2008-07-17 ✅ Patent 8,030,767 granted on 2011-10-04Bump structure with annular support
#48 | 2008-07-17 ✅ Patent 7,498,251 granted on 2009-03-03Redistribution circuit structure
#49 | 2008-05-01 ✅ Patent 7,816,771 granted on 2010-10-19Stacked chip package structure with leadframe having inner leads with transfer pad
#50 | 2008-05-01 ✅ Patent 7,663,246 granted on 2010-02-16Stacked chip packaging with heat sink structure
#51 | 2008-04-24CHIP PACKAGE STRUCTURE
#52 | 2008-04-10 ✅ Patent 7,936,032 granted on 2011-05-03Film type package for fingerprint sensor
#53 | 2008-03-13 ✅ Patent 7,786,595 granted on 2010-08-31Stacked chip package structure with leadframe having bus bar
#54 | 2008-03-13 ✅ Patent 7,615,853 granted on 2009-11-10Chip-stacked package structure having leadframe with multi-piece bus bar
#55 | 2008-02-14 ✅ Patent 7,582,953 granted on 2009-09-01Package structure with leadframe on offset chip-stacked structure
#56 | 2008-01-24 ✅ Patent 7,514,299 granted on 2009-04-07Chip package structure and manufacturing method thereof
#57 | 2008-01-24 ✅ Patent 7,361,984 granted on 2008-04-22Chip package structure
#58 | 2008-01-17 ✅ Patent 7,528,495 granted on 2009-05-05Chip structure
#59 | 2008-01-10 ✅ Patent 7,405,144 granted on 2008-07-29Method for manufacturing probe card
#60 | 2008-01-10 ✅ Patent 7,446,400 granted on 2008-11-04Chip package structure and fabricating method thereof
#61 | 2007-11-15 ✅ Patent 7,642,639 granted on 2010-01-05COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#62 | 2007-10-11 ✅ Patent 7,554,197 granted on 2009-06-30High frequency IC package and method for fabricating the same
#63 | 2007-10-04Semiconductor chip having fine pitch bumps and bumps thereon
#64 | 2007-09-20 ✅ Patent 7,579,676 granted on 2009-08-25Leadless leadframe implemented in a leadframe-based BGA package
#65 | 2007-09-06 ✅ Patent 7,651,886 granted on 2010-01-26Semiconductor device and manufacturing process thereof
#66 | 2007-07-05 ✅ Patent 7,372,286 granted on 2008-05-13Modular probe card
#67 | 2007-06-21 ✅ Patent 7,538,435 granted on 2009-05-26Wafer structure and bumping process
#68 | 2007-04-26 ✅ Patent 7,586,200 granted on 2009-09-08Light emitting diode chip with reflective layer thereon
#69 | 2007-04-19 ✅ Patent 7,385,282 granted on 2008-06-10Stacked-type chip package structure
#70 | 2007-04-19 ✅ Patent 7,576,416 granted on 2009-08-18Chip package having with asymmetric molding and turbulent plate downset design
#71 | 2007-04-19 ✅ Patent 7,622,806 granted on 2009-11-24Laser mark on an IC component
#72 | 2007-04-12 ✅ Patent 7,443,013 granted on 2008-10-28Flexible substrate for package of die
#73 | 2007-03-29 ✅ Patent 7,477,065 granted on 2009-01-13Method for fabricating a plurality of elastic probes in a row
#74 | 2007-02-01 ✅ Patent 7,504,714 granted on 2009-03-17Chip package with asymmetric molding
#75 | 2007-01-30 ✅ Patent 7,170,160 granted on 2007-01-30Chip structure and stacked-chip package
#76 | 2007-01-25 ✅ Patent 7,560,306 granted on 2009-07-14Manufacturing process for chip package without core
#77 | 2007-01-18 ✅ Patent 7,436,074 granted on 2008-10-14Chip package without core and stacked chip package structure thereof
#78 | 2006-09-21 ✅ Patent 7,370,416 granted on 2008-05-13Method of manufacturing an injector plate
#79 | 2006-06-15 ✅ Patent 7,129,730 granted on 2006-10-31Probe card assembly
#80 | 2006-06-15 ✅ Patent 7,088,118 granted on 2006-08-08Modularized probe card for high frequency probing
#81 | 2006-03-02 ✅ Patent 7,696,443 granted on 2010-04-13Electronic device with a warped spring connector
#82 | 2006-02-28 ✅ Patent 7,005,054 granted on 2006-02-28Method for manufacturing probes of a probe card
#83 | 2005-04-28 ✅ Patent 6,946,860 granted on 2005-09-20Modularized probe head
#84 | 2005-03-31 ✅ Patent 7,140,101 granted on 2006-11-28Method for fabricating anisotropic conductive substrate
#85 | 2005-01-20 ✅ Patent 6,853,205 granted on 2005-02-08Probe card assembly
Also check out ChipMOS Technologies (Bermuda) Ltd.'s (Hamilton, Bermuda) applicant profile with 2 patent applications submitted.
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