Singapore
Singapore
3
2012-05-24
3
2012-10-16
These are the the leading inventors for applications assigned to STATS ChiPAC, Ltd.:
STATS ChiPAC, Ltd. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#2 | 2011-07-07 ✅ Patent 9,184,103 granted on 2015-11-10Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars
#3 | 2010-03-11 ✅ Patent 8,263,437 granted on 2012-09-11Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
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