TECONA TECHNOLOGIES, INC.

City:

Highland Park, New Jersey

Country:

United States

Published Applications:

Last publication date:

2011-09-08

Patent Grants:

Last grant date:

Top Inventors for applications by TECONA TECHNOLOGIES, INC.

These are the the leading inventors for applications assigned to TECONA TECHNOLOGIES, INC.:

Weili SHI 1 Highland Park, NJ United States
Weili SHI 1 Highlandpark, NJ United States

Recent patent applications by TECONA TECHNOLOGIES, INC.

TECONA TECHNOLOGIES, INC. based in Highland Park, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-09-08

US20110218304A1

Chemistry; metallurgy

LOW COST AND HIGH YIELD METHOD OF MAKING LARGE QUANTITY AND HOMOGENOUS METAL NANOPARTICLES AND CONTROLLING THEIR SOLUBILITY

#2 | 2011-08-11

US20110193032A1

Electricity

COMPOSITION FOR MAKING TRANSPARENT CONDUCTIVE COATING BASED ON NANOPARTICLE DISPERSION

AssigneeID:

215523 ⎘