Morimoto Mfg. Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2010-02-04

Patent Grants:

Last grant date:

Top Inventors for applications by Morimoto Mfg. Co., Ltd.

These are the the leading inventors for applications assigned to Morimoto Mfg. Co., Ltd.:

Makoto Hosokawa 1 Osaka, Japan
Kenji Kuragake 1 Osaka, Japan
Hiroshi Matsuzaki 1 Osaka, Japan
Kunihiko Morimoto 1 Osaka, Japan

Hiroshi YAMAURA 1 Osaka, Japan
Taichi Tawada 1 Aichi, Japan

Recent patent applications by Morimoto Mfg. Co., Ltd.

Morimoto Mfg. Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-02-04

US20100029454A1

Performing operations; transporting

Method and apparatus for bonding a sheet for a corrugated cardboard box

AssigneeID:

217512 ⎘