Assignee profile:

U-BOND INC.

City:

Apia

Country:

Samoa

Published Applications:

1

Last publication date:

2010-03-04

Patent Grants:

0

Last grant date:

-

Top Inventors for applications by U-BOND INC.

These are the the leading inventors for applications assigned to U-BOND INC.:

Recent patent applications by U-BOND INC.

U-BOND INC. based in Apia, WS has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

AssigneeID:

218020 ⎘