Assignee profile:

Nippon Pillar Packaing Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2010-05-13

Patent Grants:

1

Last grant date:

2013-10-29

Top Inventors for applications by Nippon Pillar Packaing Co., Ltd.

These are the the leading inventors for applications assigned to Nippon Pillar Packaing Co., Ltd.:

Recent patent applications by Nippon Pillar Packaing Co., Ltd.

Nippon Pillar Packaing Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

AssigneeID:

220460 ⎘