Hackensack, New Jersey
United States
3
2010-12-09
3
2013-01-22
These are the the leading inventors for applications assigned to Electro Ceramic Industries:
Electro Ceramic Industries based in Hackensack, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Surface mount electronic device packaging assembly
#2 | 2007-10-11 ✅ Patent 7,569,933 granted on 2009-08-04Housing for accommodating microwave devices having an insulating cup member
#3 | 2006-12-14 ✅ Patent 7,675,167 granted on 2010-03-09Electronic device package heat sink assembly
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