Chungbuk
South Korea
11
2011-11-24
7
2012-08-07
These are the the leading inventors for applications assigned to NEPES CORPORATION:
NEPES CORPORATION based in Chungbuk, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Bump structure and fabrication method thereof
#2 | 2010-09-16 ✅ Patent 8,093,721 granted on 2012-01-10Flip chip semiconductor package and fabrication method thereof
#3 | 2010-02-11BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE
#4 | 2009-11-19 ✅ Patent 7,977,789 granted on 2011-07-12Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same
#5 | 2009-06-11SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF
#6 | 2009-04-09 ✅ Patent 7,919,833 granted on 2011-04-05Semiconductor package having a crack-propagation preventing unit
#7 | 2009-02-05SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME
#8 | 2009-01-22SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME
#9 | 2009-01-08 ✅ Patent 7,808,095 granted on 2010-10-05Ultra slim semiconductor package and method of fabricating the same
#10 | 2008-11-27 ✅ Patent 7,906,842 granted on 2011-03-15Wafer level system in package and fabrication method thereof
#11 | 2008-08-28 ✅ Patent 7,952,210 granted on 2011-05-31Semiconductor package and fabrication method thereof
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