CHIPMOS TECHNOLOGY INC.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2010-06-24

Patent Grants:

Last grant date:

2011-02-08

Top Inventors for applications by CHIPMOS TECHNOLOGY INC.

These are the the leading inventors for applications assigned to CHIPMOS TECHNOLOGY INC.:

Shih-Wen Chou 3 Tainan, Taiwan
Yu-Tang Pan 3 Tainan, Taiwan
Chun-Ying Lin 3 Tainan, Taiwan
Geng-Shin Shen 2 Tainan, Taiwan

Yu-Tang Pan 1 Sinshih Township, Taiwan
Shih-Wen Chou 1 Sinshih Township, Taiwan
Yu-Tang Pan 1 Sinshih Township, Tainan County, Taiwan
Shih-Wen Chou 1 Sinshih Township, Tainan County, Taiwan

Recent patent applications by CHIPMOS TECHNOLOGY INC.

CHIPMOS TECHNOLOGY INC. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-06-24

US20100155929A1

Electricity

Chip-Stacked Package Structure

#2 | 2010-04-22 ✅ Patent 7,884,486 granted on 2011-02-08

US20100096741A1

Electricity

Chip-stacked package structure and method for manufacturing the same

#3 | 2008-10-30

US20080265400A1

Electricity

Chip-Stacked Package Structure and Applications Thereof

#4 | 2008-10-30 ✅ Patent 7,696,629 granted on 2010-04-13

US20080265397A1

Electricity

Chip-stacked package structure

AssigneeID:

234338 ⎘