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Assignee profile:

CHIPMOS TECHNOLOGIES (BERMUDA) LTD.

City:

Hamilton HM12

Country:

Bermuda

Published Applications:

Last publication date:

2010-05-27

Patent Grants:

Last grant date:

2010-11-30

Top Inventors for applications by CHIPMOS TECHNOLOGIES (BERMUDA) LTD.

These are the the leading inventors for applications assigned to CHIPMOS TECHNOLOGIES (BERMUDA) LTD.:

Jie-Hung Chiou 3 Shanghai, China
GENG SHIN SHEN 3 Tainan County, Taiwan
Shih Wen Chou 3 Tainan County, Taiwan
DAVID WEI WANG 2 TAINAN COUNTY, Taiwan

Yong-Chao Qiao 2 Shanghai, China
Yan-Yi Wu 2 Shanghai, China
CHUNG-PANG CHI 1 TAINAN COUNTY, Taiwan
Chih-Lung Huang 1 Shanghai, China

Hua Pan 1 Shanghai, China
Chun Ying Lin 1 Tainan County, Taiwan

Recent patent applications by CHIPMOS TECHNOLOGIES (BERMUDA) LTD.

CHIPMOS TECHNOLOGIES (BERMUDA) LTD. based in Hamilton HM12, BM has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-05-27 ✅ Patent 7,843,054 granted on 2010-11-30

US20100127367A1

Electricity

Chip package and manufacturing method thereof

#2 | 2010-05-20

US20100123234A1

Electricity

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

#3 | 2008-12-25

US20080315417A1

Electricity

CHIP PACKAGE

#4 | 2008-12-18

US20080308915A1

Electricity

CHIP PACKAGE

#5 | 2008-10-30 ✅ Patent 7,960,214 granted on 2011-06-14

US20080268572A1

Electricity

Chip package

#6 | 2008-09-18

US20080224277A1

Electricity

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

#7 | 2008-07-03

US20080157304A1

Electricity

CHIP PACKAGE STRUCTURE

#8 | 2008-04-03

US20080078995A1

Electricity

CHIP STRUCTURE

#9 | 2008-01-17

US20080012106A1

Electricity

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

AssigneeID:

235002 ⎘