WINDBOND ELECTRONICS CORPORATION

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2009-02-19

Patent Grants:

Last grant date:

2005-09-06

Top Inventors for applications by WINDBOND ELECTRONICS CORPORATION

These are the the leading inventors for applications assigned to WINDBOND ELECTRONICS CORPORATION:

Oliver Chihkuang Kao 1 Cupertino, CA United States
Saleel V. Awsare 1 Redwood City, CA United States
Chie Yeon Chen 1 Hsinchu, Taiwan
Peter Holzmann 1 Campbell, CA United States

Mark Lukoyanichev 1 Yokneam Elite, Israel
Hung-Chuan Pai 1 San Jose, CA United States
Chuang Huang Kuo 1 Yi-Lan Hsien, Taiwan
Geoffrey B. Jackson 1 Campbell, CA United States

Nir Tasher 1 Tel Mond, Israel
Carl R. Palmer 1 Los Gatos, CA United States
Einat Nosovitsky 1 Hod Hasharon, Israel
Aditya Raina 1 San Jose, CA United States

Yehezkel Friedman 1 Ramat Hasharon, Israel
Ming-Bing Chang 1 Santa Clara, CA United States

Recent patent applications by WINDBOND ELECTRONICS CORPORATION

WINDBOND ELECTRONICS CORPORATION based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-02-19

US20090045822A1

Electricity

Capacitive detection systems, modules and methods

#2 | 2005-09-06 ✅ Patent 6,940,326 granted on 2005-09-06

US10252780

Frequency signal enabling apparatus and method thereof

#3 | 2005-03-08 ✅ Patent 6,865,186 granted on 2005-03-08

US9501699

Multiple message multilevel analog signal recording and playback system having memory array configurable for analog and digital storage and serial communication

AssigneeID:

242685 ⎘