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Assignee profile:

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

City:

Pingtung City

Country:

Taiwan

Published Applications:

Last publication date:

2009-10-08

Patent Grants:

Last grant date:

2012-09-25

Top Inventors for applications by ADVANCED SEMICONDUCTOR ENGINEERING, INC.

These are the the leading inventors for applications assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC.:

Hsueh An Yang 4 Taipei, Taiwan
Hsueh-An Yang 3 Taipei City, Taiwan
Po-Jen Cheng 2 Kaohsiung, Taiwan
Min Lung HUANG 1 Kaohsiung, Taiwan

Meng-Jen Wang 1 Pingtung City, Taiwan
Ren Yih JENG 1 Jhongli City, Taiwan
Ying-Te OU 1 Kaohsiung, Taiwan
CHANG-CHI LEE 1 Kaohsiung City, Taiwan

Pei Chun CHEN 1 Tainan County, Taiwan
Ren Yih Jeng 1 Jhongli, Taiwan
Jian-Cheng CHEN 1 Tainan County, Taiwan
Tong Hong WANG 1 Selangor D.E., Malaysia

Kuang Hsiung Chen 1 Taoyuan, Taiwan
Yung-Hui Wang 1 Kaohsiung City, Taiwan
Wei-Chung Wang 1 Kaohsiung County, Taiwan
Ying-Te Ou 1 Kaohsiung City, Taiwan

Chien-Fan CHEN 1 Kaohsiung City, Taiwan
Chun Hung HSU 1 Fusing Township, Taiwan
Kuang-Hsiung Chen 1 Taoyuan City, Taiwan
Meng-Jen Wang 1 Pingtung, Taiwan

Yung-Hui WANG 1 Kaohsiung, Taiwan

Recent patent applications by ADVANCED SEMICONDUCTOR ENGINEERING, INC.

ADVANCED SEMICONDUCTOR ENGINEERING, INC. based in Pingtung City, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-10-08 ✅ Patent 8,273,445 granted on 2012-09-25

US20090252931A1

Electricity

Reinforced assembly carrier

#2 | 2009-10-08 ✅ Patent 8,099,865 granted on 2012-01-24

US20090249618A1

Electricity

Method for manufacturing a circuit board having an embedded component therein

#3 | 2009-09-17

US20090230544A1

Electricity

HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR CONFIGURING HEAT SINKS ON A SEMICONDUCTOR PACKAGE

#4 | 2009-08-27 ✅ Patent 7,651,888 granted on 2010-01-26

US20090215228A1

Performing operations; transporting

Wafer lever fixture and method for packaging micro-electro-mechanical-system devices

#5 | 2009-02-19 ✅ Patent 7,863,181 granted on 2011-01-04

US20090047782A1

Electricity

Method for manufacturing a device having a high aspect ratio via

#6 | 2008-12-11 ✅ Patent 7,501,342 granted on 2009-03-10

US20080303167A1

Electricity

Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same

#7 | 2008-12-11 ✅ Patent 7,709,913 granted on 2010-05-04

US20080303106A1

Physics

Image sensor package and packaging method for the same

#8 | 2008-10-23

US20080261390A1

Electricity

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

#9 | 2008-09-25 ✅ Patent 7,681,779 granted on 2010-03-23

US20080230587A1

Performing operations; transporting

Method for manufacturing electric connections in wafer

#10 | 2008-08-07 ✅ Patent 8,072,081 granted on 2011-12-06

US20080185699A1

Performing operations; transporting

Microelectromechanical system package

AssigneeID:

242800 ⎘