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Assignee profile:

Kanji OTSUKA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2009-03-19

Patent Grants:

Last grant date:

2011-03-15

Top Inventors for applications by Kanji OTSUKA

These are the the leading inventors for applications assigned to Kanji OTSUKA:

Kanji Otsuka 6 Tokyo, Japan
Tamotsu Usami 5 Kokubunji-shi, Tokyo, Japan
Yutaka Akiyama 5 Tokyo, Japan
Tamotsu Usami 4 Tokyo, Japan

Kanji Otsuka 4 Higashiyamato-shi, Tokyo, Japan
Tamotsu Usami 3 Kokubunji-shi, Tokyo 185-0035, Japan
Kanji Otsuka 3 Higashiyamato-shi, Tokyo 207-0002, Japan
Kanji Otsuka 2 Higashiyamato-shi, Japan

Tamotsu Usami 2 Kokubunji-shi, Japan
Tamotsu Usami 1 Nishimachi, Kokubunji-shi, Tokyo 185-0035, Japan
Yutaka Akiyama 1 Hachioji-shi, Tokyo, Japan
Kanji Otsuka 1 Kohan, Higashiyamato-shi, Tokyo 207-0002, Japan

Yutaka Akiyama 1 Hachioji-shi, Tokyo 192-0914, Japan
Yutaka Akiyama 1 Hachiouji, Japan
Yutaka Akiyama 1 Hachiouji-shi, Tokyo 192-0914, Japan
Tsuneo Ito 1 Tokyo, Japan

Kanji Otsuka 1 Kohan, Higashiyamato-shi, Tokyo, Japan
Chihiro Ueda 1 Adachi-ku, Tokyo 121-0801, Japan
Kanji Otsuka 1 Higashiyamato, Japan
Tamotsu Usami 1 Nishimachi, Kokubunji-shi, Tokyo, Japan

Chihiro Ueda 1 Tokyo, Japan
Tadatomo SUGA 1 Nakano-ku, Tokyo, Japan
Tsuneo Ito 1 Oume-shi, Tokyo 198-0171, Japan
Yuko Tanba 1 Oume-shi, Tokyo 198-0024, Japan

Kanji Otsuka 1 Higashiyamamto-shi, Tokyo, Japan
Yuko Tanba 1 Tokyo, Japan

Recent patent applications by Kanji OTSUKA

Kanji OTSUKA based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-03-19 ✅ Patent 7,906,840 granted on 2011-03-15

US20090072358A1

Electricity

Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure

#2 | 2008-12-25 ✅ Patent 7,872,612 granted on 2011-01-18

US20080316136A1

Electricity

Antenna apparatus utilizing aperture of transmission line

#3 | 2008-12-18 ✅ Patent 7,969,256 granted on 2011-06-28

US20080310521A1

Electricity

Signal transmission circuit and signal transmission system with reduced reflection

#4 | 2008-11-04 ✅ Patent 7,446,567 granted on 2008-11-04

US10775223

Signal transmission apparatus and interconnection structure

#5 | 2008-02-21 ✅ Patent 7,791,852 granted on 2010-09-07

US20080042686A1

Electricity

Electrostatic discharge protection circuit and terminating resistor circuit

#6 | 2007-08-02 ✅ Patent 7,446,625 granted on 2008-11-04

US20070176708A1

Electricity

Narrow impedance conversion device

#7 | 2006-10-12 ✅ Patent 7,631,422 granted on 2009-12-15

US20060226927A1

Electricity

Method of manufacturing wiring substrate having terminated buses

#8 | 2006-10-03 ✅ Patent 7,116,184 granted on 2006-10-03

US10079464

Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture

#9 | 2006-09-14 ✅ Patent 7,280,385 granted on 2007-10-09

US20060203586A1

Electricity

Semiconductor memory device

#10 | 2005-12-13 ✅ Patent 6,975,489 granted on 2005-12-13

US10348896

Circuit structure and semiconductor integrated circuit

#11 | 2005-07-05 ✅ Patent 6,914,502 granted on 2005-07-05

US9988017

Wiring structure for transmission line having grooved conductors

#12 | 2005-02-24 ✅ Patent 7,190,188 granted on 2007-03-13

US20050040846A1

Electricity

Signal transmission system, and signal transmission line

Also check out Kanji Otsuka's (Tokyo, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

244352 ⎘