ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2023-04-06

Patent Grants:

Last grant date:

2025-09-02

Top Inventors for applications by ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.

These are the the leading inventors for applications assigned to ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.:

Chris Chang Yu 3 Shanghai, China
Ying YAO 2 Shanghai, China
Danny Zhenglong Shiao 2 Shanghai, China
Andy Chunxiao Yang 2 Shanghai, China

Shumin Wang 2 Shanghai, China
Jianfen JING 2 Shanghai, China
Xinyuan CAI 2 Shanghai, China
JIAN MA 2 SHANGHAI, China

Wenting ZHOU 2 Shanghai, China
Shoutian Li 1 Shanghai, China
Changzheng Jia 1 Shanghai, China
Xiaoming Ren 1 Shanghai, China

Junya YANG 1 Shanghai, China
Pengcheng BIAN 1 Shanghai, China
Guohao WANG 1 Shanghai, China
Kai SONG 1 Shanghai, China

Heng Li 1 Shanghai, China

Recent patent applications by ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.

ANJI MICROELECTRONICS (SHANGHAI) CO., LTD. based in Shanghai, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-04-06 ✅ Patent 12,404,423 granted on 2025-09-02

US20230104112A1

Chemistry; metallurgy

CHEMICAL-MECHANICAL POLISHING LIQUID

#2 | 2022-02-24 ✅ Patent 12,098,299 granted on 2024-09-24

US20220056308A1

Chemistry; metallurgy

Chemical mechanical polishing slurry and use thereof

#3 | 2021-06-03 ✅ Patent 11,898,063 granted on 2024-02-13

US20210163786A1

Chemistry; metallurgy

Chemical-mechanical polishing solution

#4 | 2021-05-13 ✅ Patent 11,746,257 granted on 2023-09-05

US20210139740A1

Chemistry; metallurgy

Chemical mechanical polishing solution

#5 | 2009-05-14 ✅ Patent 7,947,195 granted on 2011-05-24

US20090121178A1

Chemistry; metallurgy

Polishing slurry

#6 | 2009-04-23 ✅ Patent 8,038,749 granted on 2011-10-18

US20090100764A1

Chemistry; metallurgy

Composition for removing photoresist layer and method for using it

#7 | 2009-04-16

US20090095320A1

Physics

Composition for Removing Photresist Layer and Method for Using it

#8 | 2008-08-14 ✅ Patent 7,776,231 granted on 2010-08-17

US20080190894A1

Chemistry; metallurgy

Chemical mechanical polishing slurries, their applications and method of use thereof

Also check out ANJI MICROELECTRONICS (SHANGHAI) CO., LTD's (Shanghai, China) applicant profile with 5 patent applications submitted.

AssigneeID:

245649 ⎘