3D Plus

City:

Cedex

Country:

France

Published Applications:

Last publication date:

2009-10-22

Patent Grants:

Last grant date:

2013-10-29

Top Inventors for applications by 3D Plus

These are the the leading inventors for applications assigned to 3D Plus:

3D Plus based in Cedex, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

Process for the vertical interconnection of 3D electronic modules by vias

AssigneeID:

255215 ⎘