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Assignee profile:

NEC ELECTRONICS CORPORATION

City:

Tokyo

Country:

Japan

Published Applications:

22

Last publication date:

2011-02-24

Patent Grants:

21

Last grant date:

2011-12-13

Top Inventors for applications by NEC ELECTRONICS CORPORATION

These are the the leading inventors for applications assigned to NEC ELECTRONICS CORPORATION:

Recent patent applications by NEC ELECTRONICS CORPORATION

NEC ELECTRONICS CORPORATION based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-02-24 ✅ Patent 8,077,466 granted on 2011-12-13
US20110044007A1
Electricity

Heat sink, semiconductor device, and method of manufacturing heat sink

 #2 | 2009-11-26 ✅ Patent 8,013,682 granted on 2011-09-06
US20090289724A1
Electricity

Frequency synthesizer and method for controlling same

 #3 | 2008-10-28 ✅ Patent 7,443,391 granted on 2008-10-28
US10801819
-

Current drive circuit and display

 #4 | 2008-07-29 ✅ Patent 7,405,958 granted on 2008-07-29
US10464010
-

Magnetic memory device having XP cell and Str cell in one chip

 #5 | 2008-07-08 ✅ Patent 7,397,125 granted on 2008-07-08
US10761204
-

Semiconductor device with bonding pad support structure

 #6 | 2007-09-25 ✅ Patent 7,274,395 granted on 2007-09-25
US10012405
-

MOS-type image sensor configured to reduce coupling noise

 #7 | 2007-09-11 ✅ Patent 7,268,087 granted on 2007-09-11
US10900355
-

Manufacturing method of semiconductor device

 #8 | 2007-07-12 ✅ Patent 7,524,723 granted on 2009-04-28
US20070161201A1
Electricity

Semiconductor device and method for manufacturing same

 #9 | 2007-07-12
US20070161156A1
Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #10 | 2007-05-10 ✅ Patent 7,655,506 granted on 2010-02-02
US20070105281A1
Electricity

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

 #11 | 2007-03-01 ✅ Patent 7,638,821 granted on 2009-12-29
US20070045770A1
Electricity

Integrated circuit incorporating decoupling capacitor under power and ground lines

 #12 | 2006-07-13 ✅ Patent 7,464,352 granted on 2008-12-09
US20060156263A1
Physics

Methods for designing, evaluating and manufacturing semiconductor devices

 #13 | 2006-01-05 ✅ Patent 7,446,059 granted on 2008-11-04
US20060003599A1
Electricity

Semiconductor device and method for manufacturing same

 #14 | 2005-08-16 ✅ Patent 6,930,037 granted on 2005-08-16
US9737397
-

Process for forming a metal interconnect

 #15 | 2005-08-09 ✅ Patent 6,927,495 granted on 2005-08-09
US10642279
-

Semiconductor device and method of manufacturing same

 #16 | 2005-07-21 ✅ Patent 7,400,134 granted on 2008-07-15
US20050156616A1
Physics

Integrated circuit device with multiple chips in one package

 #17 | 2005-06-23 ✅ Patent 7,414,506 granted on 2008-08-19
US20050134419A1
Electricity

Semiconductor integrated circuit and fabrication method thereof

 #18 | 2005-05-17 ✅ Patent 6,894,370 granted on 2005-05-17
US10207055
-

Lead frame and semiconductor device having the same as well as method of resin-molding the same

 #19 | 2005-04-19 ✅ Patent 6,883,060 granted on 2005-04-19
US9401293
-

Microcomputer provided with flash memory and method of storing program into flash memory

 #20 | 2005-02-01 ✅ Patent 6,849,490 granted on 2005-02-01
US9864259
-

Semiconductor device having a memory cell region and a peripheral circuit region and method of manufacturing thereof

 #21 | 2005-02-01 ✅ Patent 6,849,950 granted on 2005-02-01
US9604527
-

Semiconductor device and method of manufacturing same

 #22 | 2005-01-20 ✅ Patent 7,443,376 granted on 2008-10-28
US20050012728A1
Physics

Scan electrode driving circuit and display apparatus
AssigneeID:

256843 ⎘