Hukou Township
Taiwan
14
2008-11-06
3
2010-07-27
These are the the leading inventors for applications assigned to Advanced Chip Engineering Technology Inc.:
Advanced Chip Engineering Technology Inc. based in Hukou Township, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor device package with multi-chips and method of the same
#2 | 2008-11-06Wafer level image sensor package with die receiving cavity and method of making the same
#3 | 2008-10-16Semiconductor device package having multi-chips with side-by-side configuration and method of the same
#4 | 2008-10-02SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
#5 | 2008-08-21Semiconductor device package with multi-chips and method of the same
#6 | 2008-08-21Semiconductor device package with multi-chips and method of the same
#7 | 2008-08-21Multi-chips package with reduced structure and method for forming the same
#8 | 2008-08-21Wafer level image sensor package with die receiving cavity and method of making the same
#9 | 2008-08-14Image sensor package with die receiving opening and method of the same
#10 | 2008-07-24Image sensor module and the method of the same
#11 | 2008-07-03Semiconductor device package having pseudo chips
#12 | 2008-01-24Structure of image sensor module and a method for manufacturing of wafer level package
#13 | 2007-12-27 ✅ Patent 7,884,464 granted on 2011-02-083D electronic packaging structure having a conductive support substrate
#14 | 2005-11-10 ✅ Patent 7,985,626 granted on 2011-07-26Manufacturing tool for wafer level package and method of placing dies
259650 ⎘