THE NEXSYS CORPORATION

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2008-03-20

Patent Grants:

Last grant date:

2008-11-11

Top Inventors for applications by THE NEXSYS CORPORATION

These are the the leading inventors for applications assigned to THE NEXSYS CORPORATION:

Hitoshi OHMORI 2 Saitama, Japan
Yoshihiro Uehara 1 Wako, Japan
Kazutoshi Katahira 1 Wako, Japan
Hitoshi Omori 1 Wako, Japan

Masao Washio 1 Saitama, Japan
Takahiro Miura 1 Nagoya, Japan
Norihide Mitsuishi 1 Chiyoda-ku, Japan
Takahiro MIURA 1 Aichi, Japan

Norihide Mitsuishi 1 Tokyo, Japan
Naoshi Iwamitsu 1 Nagoya, Japan
Yoshihiro Uehara 1 Saitama, Japan
Hitoshi Omori 1 Wako-shi, Japan

Yoshihiro Uehara 1 Wako-shi, Japan
Hitoshi Ohmori 1 Wako, Japan
Hatsuichi Takeyasu 1 Tokyo, Japan
Muneaki Asami 1 Chiyoda-ku, Japan

Weimin Lin 1 Saitama, Japan
Takeya Shoji 1 Saitama, Japan
Yukihiro Shirataki 1 Saitama, Japan
Tomoaki Ando 1 Saitama, Japan

Souichi Ishikawa 1 Chiyoda-ku, Japan
Naoshi Iwamitsu 1 Aichi, Japan
Kazutoshi Katahira 1 Wako-shi, Japan
Keizo Ikegami 1 Saitama, Japan

Recent patent applications by THE NEXSYS CORPORATION

THE NEXSYS CORPORATION based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-03-20

US20080067704A1

Performing operations; transporting

Micro-Molding Equipment and Micro-Molding Method

#2 | 2007-08-30 ✅ Patent 7,448,120 granted on 2008-11-11

US20070199187A1

Performing operations; transporting

Apparatus and method for machining long workpiece

#3 | 2006-06-15 ✅ Patent 7,758,741 granted on 2010-07-20

US20060124473A1

Performing operations; transporting

Method and apparatus for nozzle type ELID grinding

AssigneeID:

262175 ⎘