MICROELECTRONIC PACKAGING DRESDEN GMBH

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2008-06-12

Patent Grants:

Last grant date:

Top Inventors for applications by MICROELECTRONIC PACKAGING DRESDEN GMBH

These are the the leading inventors for applications assigned to MICROELECTRONIC PACKAGING DRESDEN GMBH:

Stephen Karl 1 Grossdittmannsdorf, Germany
Andreas Fischer 1 Berga, Germany
Gregor Woldt 1 Dresden, Germany
Mario Loeffler 1 Dresden, Germany

Werner Schneider 1 Dresden, Germany

Recent patent applications by MICROELECTRONIC PACKAGING DRESDEN GMBH

MICROELECTRONIC PACKAGING DRESDEN GMBH based in Dresden, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-06-12

US20080136920A1

Electricity

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AssigneeID:

265565 ⎘