PACKER ENGINEERING, INC.

City:

Naperville, Indiana

Country:

United States

Published Applications:

Last publication date:

2008-06-26

Patent Grants:

Last grant date:

Top Inventors for applications by PACKER ENGINEERING, INC.

These are the the leading inventors for applications assigned to PACKER ENGINEERING, INC.:

JingYing Zhang 1 Kirkland, WA United States
John C. Christenson 1 Kokomo, IN United States
David W. Yen 1 Dayton, OH United States
Peter J. Schubert 1 Naperville, IL United States

Recent patent applications by PACKER ENGINEERING, INC.

PACKER ENGINEERING, INC. based in Naperville, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-06-26

US20080149594A1

Electricity

APPARATUS AND PROCESS FOR FORMING AND HANDLING POROUS MATERIALS

AssigneeID:

266146 ⎘